Steve started GamersNexus back when it was just a cool name, and now it's grown into an expansive website with an overwhelming amount of features. He recalls his first difficult decision with GN's direction: "I didn't know whether or not I wanted 'Gamers' to have a possessive apostrophe -- I mean, grammatically it should, but I didn't like it in the name. It was ugly. I also had people who were typing apostrophes into the address bar - sigh. It made sense to just leave it as 'Gamers.'"
First world problems, Steve. First world problems.
Following our in-depth first-look coverage of the EVGA GTX 1080 Ti Kingpin card, we now turn to the company’s upcoming motherboard releases in the X299 family. This coincides with Intel’s Kaby Lake X (KBL-X) & Skylake-X (SKY-X) CPU announcement from today, and marks the announcement of EVGA’s continued embattlement in the motherboard market. All the boards are X299 (LGA 2066) to support Intel’s refreshed KBL and new SKY-X CPUs, consolidating the platforms into a single socket type and with greater DIMM support. That doesn’t mean, however, that the motherboard makers will fully exploit the option of additional DIMMs for HEDT CPUs; EVGA has elected to forfeit half the DIMMs on the new EVGA X299 DARK board in favor of greater overclocking potential. We’ll talk through the specs on the new EVGA X299 DARK, X299 Micro, and X299 FTW K, along with VRM design and power components used.
The motherboard lineup does not yet include pricing or hard release dates, but we do know that the tiering will go: Dark > FTW K > Micro, with regard to price.
EVGA’s GTX 1080 Ti Kingpin made its first debut to a group of press before Computex 2017, and we were given the privilege of being the first media to tear-down the card. The Kingpin edition 1080 Ti is EVGA’s highest-end video card – price TBD – and is built for extreme overclockers and enthusiasts.
The GTX 1080 Ti Kingpin uses an oversized PCB that’s similar to the FTW3, though with different components, and a two-slot cooler that partners with NTC thermistors on the VRM + VRAM components. This means that, like the FTW3, the cooling solution slaves to independent component temperatures, with a hard target of keeping all ICs under 60C (even when unnecessary or functionally useless, like for the MCUs). The Kingpin model card uses a copper-plated heatsink, six heatpipes, and the usual assortment of protrusions on the baseplate for additional surface area, but also makes accommodations for LN2 overclocking. We’ll start with detailing the air cooler, then get into LN2 and power coverage.
MSI’s GTX 1080 Ti Armor card piqued our attention for its weak stock cooler and non-reference PCB: The card, at $700, appears to be the closest we’ll get to a bare 1080 Ti PCB sale. It’s an ideal liquid cooling candidate, particularly given the overwhelmingly negative user reviews pertaining to the card’s propensity to overheat. The photos made the Armor look like a Gaming X PCB -- something we praised in our PCB & VRM electrical analysis -- but with a GTX 1070 class cooler stuck onto it. If that were the case, it’d mean the 1080 Ti Armor would perform dismally in thermals when tested with its stock cooler, but could make for a perfect H2O card.
We decided to buy one and find out why the MSI Armor had such bad user reviews, and if it’d be possible to turn the card into the best deal for a liquid-cooled 1080 Ti.
When we made our “how air coolers work” video, a lot of viewers were interested in the inner workings of copper heatpipes and their various means of facilitating capillary action. Today, we’re revisiting our TLDR series with a video on how closed-loop liquid coolers work. We’ll be talking about permeation, air pockets, stators, impellers, coldplates, and chemical composition of the coolant.
This content has custom-made animations that we rendered specifically for explanation of how CLCs work. GN’s Andrew Coleman modeled and animated a closed-loop cooler for the piece, referencing NZXT’s Kraken X52. Because of the level of detail and custom animations of this content, NZXT sponsored GN to put this piece together. The content applies to all liquid coolers, but particularly focuses on closed-loop products; all concepts herein can be applied to CLCs across the industry from various suppliers and manufacturers. Our technical deep-dive for today serves as a means to fully detail liquid cooling and how it works, drilling down to piano-wire granularity (literally).
One of the most frustrating aspects of the hardware industry is when a company made a perfectly viable product, but somehow flummoxed execution. The consumer doesn’t see the architecture or the engineering – at least, not outside of reviews – they see the full picture. In this capacity, consumers get a view of a product that is similar to a product manager’s: The big picture as it comes together, seeing past all the smaller details along the way.
A GPU might, for instance, be a powerhouse when analyzed under an SEM or in a vacuum, but could prove hamstrung in adverse thermal conditions resultant of an inadequate cooler. More appropriately, a laptop could host the best mobile hardware available, but prove devalued when flooded with unneeded software. The fastest SSD in the business, as bogged down with bloatware, will still be slower than a clean Windows install on a fresh HDD.
This big picture is sometimes lost to the chaos of marketing development efforts, particularly when MDF starts exchanging hands, and lost in the need to turn a profit in an industry with small margins. That’s what happened with MSI’s laptops: These are completely capable, highly competitive laptops that demand attention – but they’re plagued with an ineffable concoction of applications, responsible for doubling time required to boot. That’s not all, either – we have measured an impact to noise output as the CPU boosts sporadically, an unpredictable and spurious impact to frametimes, an impact to battery life, and an overall reduction in product quality.
All because of bloatware.