We ran into professional overclocker Der8auer at G.Skill’s Computex booth, who was keen to give us a hands-on delidding demonstration of a new 10C/20T Intel Skylake-X CPU. During the process, we also got our first real hands-on look at the CPU substrate and package – interesting in its own right – and underlying thermal compound choice. The lack of solder could have an explanation in chip longevity, something we’ll talk about a bit later.

This process involves Der8auer’s new delidding kit, an Allen wrench (looked like a 5mm wrench), and some force. Nothing difficult. The process is identical for both KBL-X and SKY-X, with the disclaimer that larger SKY-X CPU dies (like 14-18C chips) could pose some difficulties with extra capacitor density surrounding the CPU die. There’s much greater risk of damaging or destroying the 14C to 18C CPUs given this challenge, and although the 10C CPU was trivial, risk of damage is also present. SMD components sit close to the outer glue of the IHS, which means that delidding could potentially rip one of the SMDs off of the substrate. The SMDs on the sides of the CPU die are for memory channels, with the capacitor and RFID chip in the corner being less critical.

We attended AMD’s Press Conference event today in Taipei, Taiwan at Computex, where the company discussed its existing and new products for 2017. For our audience, the main focuses would be on the Threadripper 16C/32T CPU and Radeon RX Vega GPUs, both of which were highlighted at the event. AMD also began to lay-out their plan to enter the mobile market with R7 and R5 CPUs, as well as RX 500 series GPUs. The Ryzen R3 CPU lineup was not discussed in depth, but a Q3 launch date was confirmed during the press conference.

AMD presented their Vega Frontier Edition earlier in the month, with the card aimed towards deep learning, content creation, and enterprise industries alike. Vega: FE’s launch date is set for June 27 . The press event provided very limited information in regards to the Radeon RX Vega gaming GPUs, with the information dispensed primarily pertaining to the release date: RX Vega GPUs are set to launch at Siggraph 2017, which runs from July 30 to August 3, 2017 in Los Angeles.

We attended EVGA’s Press Day in Taipei before the start of Computex, where we tore down the new Kingpin 1080 Ti card and spoke with engineering staff about power design. EVGA showcased a number of other items too, including the DG-70 line of cases, a new mechanical keyboard, and EVGA’s new SC15 laptop.

The new ATX mid-tower cases are the DG-73, DG-75, and DG-76, all of which use the same tooling (from what we’ve seen thus far), meaning the differences are largely cosmetic. The DG-73 will be the most budget-focused and features an acrylic side panel window, while the DG-75/76 have tempered glass panels. All three have a tempered glass front panel that is slightly offset, which could allow for front airflow intake through side ventilation, something we’ve seen before. Cable routing could prove to be difficult as there are no dedicated pass-throughs or grommets; instead, the DG-73, DG-75, and DG-76 use an open plate style design for cable management.

Maligned as they are by gamers, rubber dome keyboards have one great advantage (other than price): they’re hard to get dirty and easy to clean, thanks to the eponymous rubber membrane, which usually keeps dust and liquid away from the underlying contacts. Corsair now intends to correct this with their new extra-durable K68 keyboard.

Corsair imagines a horrifying, over-the-top scenario:

Preceding the embargo lift of Intel’s X299 announcement, we met with Gigabyte at Computex 2017 to discuss the company’s new line of X299 motherboards. New launches include the Gaming 9, Gaming 7, Gaming 3, and Ultra Durable 4 motherboards (along with a workstation board, which we won’t focus on) for the X299 chipset, hosting KBL-X and SKY-X CPUs. We’ve already detailed some of EVGA’s boards as well, so if KBL-X or SKY-X interests you, also check that content out.

That said, we’re still not quite sure why KBL-X exists. It’s an odd part: Kaby Lake refreshed on a new socket type, where half the motherboards will be comparatively overpriced by means of being outfitted for Skylake-X parts. KBL-X won’t, for instance, be able to leverage the left half of the DIMM slots on the X299 boards, while SKY-X will. It’s a weird move from Intel. Regardless, they’re not our focus right now: Let’s start with Gigabyte’s Gaming 9 line and work our way down, keeping in mind that these boards are really best leveraged with Skylake-X, though are technically compatible with KBL-X.

Intel seemingly moved its KBL-X and SKY-X CPU launches up, with the spotlight pointed at nine new enthusiast-class CPUs. A few of these are more similar to refreshes than others, but we also see the introduction of the i9 line of Intel CPUs, scaling up to 18C and 36T on the i9-7980XE CPU. We’ll go over prices and specs in this Computex news item, and note that we’ve already got motherboard coverage online for EVGA’s new X99 motherboards.

Starting with the marketing, then.

Following our in-depth first-look coverage of the EVGA GTX 1080 Ti Kingpin card, we now turn to the company’s upcoming motherboard releases in the X299 family. This coincides with Intel’s Kaby Lake X (KBL-X) & Skylake-X (SKY-X) CPU announcement from today, and marks the announcement of EVGA’s continued embattlement in the motherboard market. All the boards are X299 (LGA 2066) to support Intel’s refreshed KBL and new SKY-X CPUs, consolidating the platforms into a single socket type and with greater DIMM support. That doesn’t mean, however, that the motherboard makers will fully exploit the option of additional DIMMs for HEDT CPUs; EVGA has elected to forfeit half the DIMMs on the new EVGA X299 DARK board in favor of greater overclocking potential. We’ll talk through the specs on the new EVGA X299 DARK, X299 Micro, and X299 FTW K, along with VRM design and power components used.

The motherboard lineup does not yet include pricing or hard release dates, but we do know that the tiering will go: Dark > FTW K > Micro, with regard to price.

EVGA’s GTX 1080 Ti Kingpin made its first debut to a group of press before Computex 2017, and we were given the privilege of being the first media to tear-down the card. The Kingpin edition 1080 Ti is EVGA’s highest-end video card – price TBD – and is built for extreme overclockers and enthusiasts.

The GTX 1080 Ti Kingpin uses an oversized PCB that’s similar to the FTW3, though with different components, and a two-slot cooler that partners with NTC thermistors on the VRM + VRAM components. This means that, like the FTW3, the cooling solution slaves to independent component temperatures, with a hard target of keeping all ICs under 60C (even when unnecessary or functionally useless, like for the MCUs). The Kingpin model card uses a copper-plated heatsink, six heatpipes, and the usual assortment of protrusions on the baseplate for additional surface area, but also makes accommodations for LN2 overclocking. We’ll start with detailing the air cooler, then get into LN2 and power coverage.

Kingston has announced their first NVMe SSD, and it will debut under the KC series as the KC1000. In recent years, Kingston has seemingly directed power users and gamers towards the HyperX brand, but the KC1000 could help guide the KC series in a different direction.

Kingston seems to be targeting a very wide audience with the new KC1000, as Kingston lists the video editing, virtual reality, CAD, streaming, and gaming applications for the KC1000. Here's a list of the targeted use cases of the KC1000:

  • High-resolution video editing
  • Virtual and augmented reality applications
  • CAD software applications
  • Streaming media
  • Graphically intensive video games
  • Data visualization
  • Real-time analytics

MSI’s GTX 1080 Ti Armor card piqued our attention for its weak stock cooler and non-reference PCB: The card, at $700, appears to be the closest we’ll get to a bare 1080 Ti PCB sale. It’s an ideal liquid cooling candidate, particularly given the overwhelmingly negative user reviews pertaining to the card’s propensity to overheat. The photos made the Armor look like a Gaming X PCB -- something we praised in our PCB & VRM electrical analysis -- but with a GTX 1070 class cooler stuck onto it. If that were the case, it’d mean the 1080 Ti Armor would perform dismally in thermals when tested with its stock cooler, but could make for a perfect H2O card.

We decided to buy one and find out why the MSI Armor had such bad user reviews, and if it’d be possible to turn the card into the best deal for a liquid-cooled 1080 Ti.

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