As solid-state storage continues to displace mechanical drives, so too does the constriction of the HDD market continue. As part of their ongoing plan to stay profitable and financially stable, Seagate has opted to shut down its HDD manufacturing facility in Suzhou, China. The Suzhou plant was one of Seagate’s largest production assets, and its resultant closure will acutely reduce the company’s HDD output.
However, this isn’t unforeseen, as last year Seagate announced its intentions to augment manufacturing capacities from around 55-60 million drives per quarter to approximately 35-40 million drives per quarter in accordance with their continued restructuring initiative. As part of that effort, Seagate reduced global employee headcount by 8,000 last year. Moreover, the closing of the Suzhou facility will see the layoff of a further ~2,200 employees.
Preorders are now open for the iBUYPOWER “Snowblind” system we’ve been covering for the past few months, most recently at CES 2017. The most notable aspect of Project Snowblind is the modified NZXT Noctis 450 enclosure, which uses an LCD side panel in place of a traditional clear window.
To be clear: although the buzz surrounding Project Snowblind is generally about the side panel, Snowblind systems are complete prebuilt machines and their enclosures are not available separately at this time (see our Noctis 450 review for details on the non-LCD version). As such, there are three SKUs available for preorder: Snowblind, Snowblind Pro, and Snowblind Extreme, for $1500, $1800, and $2500 respectively, with monthly payment plans optional. Additional components can be added for additional cost, but only white or silver varieties are allowed in order to give the panel maximum contrast.
This is our first episode of Ask GN since returning from CES, responsible for producing about two weeks’ worth of content that we’ve only just finished publishing. For this episode, we’re addressing questions pertaining primarily to reflowing / reballing dead components (laptops & GPUs), OEM vs. non-OEM CPUs, and a couple of airflow topics related to liquid cooling. Other questions include clarification on Kaby Lake & Skylake compatibilities, and keyboard USB passthrough impact on latency.
For our regulars, the usual accompaniment to Ask GN articles is a preview on what’s to come for the week. This week, we’ve got several CPU content items planned, a PC build, and lots of behind-the-scenes testing that will be published next week.
We’ve noticed that one of the important factors in team game coordination and success is the extent of communication. That’s no big surprise for anyone, but it’s especially true for faster-paced games such as shooters and MOBAs. Oftentimes, text wheels and typing are decent, but in the heat of the moment nothing beats using a mic to communicate.
Unfortunately, many users may not have much desk space for a desk mic or might have a lot of background noise, making it less than ideal to grab a broadcast mic. Further, for folks who already own high-end headphones that they don’t want to replace with a headset (which oftentimes have mediocre mics and speakers), it’d be nice to keep using those headphones just with a mic attachment. This leaves few options except for clip-on mics (which are easy to hit, annoying to use, and sometimes require amps) or something like the Antlion ModMic. We previously reviewed the ModMic 4 and found it to be a reliable product, with some minor issues that were largely overlooked at its price tag.
We just received Antlion’s new version of the ModMic for review: the ModMic 5. This new version features more robust build quality, omni- and uni-directional mics, and a removable mute switch, but it also has a higher price tag of $70.
The official reveal of the Nintendo Switch left a lot to be desired, particularly in the hardware department. That’s not particularly surprising with Nintendo -- the company isn’t known for being open with its CPU and GPU specifications -- but we already have a Switch on pre-order for tear-down and in-depth performance analysis in the lab.
Regardless, even without further specs from Nintendo, we can still go through the basics and make some assumptions based on fairly credible leaks that are out there.
AMD may have inadvertently given out information today that could narrow down the release window for their upcoming Ryzen CPUs. The possible release date information was provided by a panel description for the upcoming Game Developers Conference (GDC), where AMD will host a panel detailing Zen optimization techniques for programmers. GDC 2017 takes place from February 27-March 3. This coupled with the AMD panel description from the GDC website (and our own digging while at CES) tells us that Ryzen will ship at the end of February.
In the original panel description (that has since been changed), AMD was asking session attendees to join their “Game Engineering team members for an introduction to the recently-launched AMD Ryzen CPU.” “Recently-launched” is the key phrase and indicates that the Ryzen CPU would likely already be available prior to GDC 2017, which again is February 27-March 3.
This year’s case manufacturers will primarily be focused on shifting to USB Type-C – you heard it here first – as the upcoming trend for case design. Last year, it was a craze to adopt tempered glass and RGB LEDs, and that’s plainly not stopped with this year’s CES. That trend will carry through the half of 2017, and will likely give way to Type-C-heavy cases at Computex in May-June.
For today, we’re looking at the best PC cases of 2017 thus far, as shown at the annual Consumer Electronics Show (CES). Our case round-ups are run every year and help to determine upcoming trends in the PC cases arena. This year’s collection of the top computer cases (from $60 to $2000) covers the major budget ranges for PC building.
AMD’s Ryzen platform is on its march to the launch window – likely February of 2017 – and will be pushing non-stop information until its time of delivery. For today, we’re looking at the CPU and chipset architectures in greater depth, following-up on yesterday’s motherboard reveal.
First, let’s clear-up nomenclature confusion: “Zen” is still the AMD next generation CPU architecture name. “Ryzen” is the family of CPUs, comparable to Intel’s “Core” family in some loose ways. Each Ryzen CPU will exist on the Zen architecture, and each Ryzen CPU will have its own individual alphanumeric identifier (just like always).
CES 2017 allowed our team to dig deeper into the Zen architecture, its Ryzen family of CPUs, and the ensemble of AM4 motherboards in the pipes. There are currently “more than 50” SKUs of AM4 motherboards, according to the AMD team, and that’ll include the X370, B350, A320, and A/B/X300 chipsets. In this article, we’ll provide a GN-made block diagram of Ryzen’s PCIe lanes and other features, a look at ASRock and Biostar motherboards, and some brief notes on the S3.0 radiator.
Before diving in, here’s a block diagram that GamersNexus created to better represent the Ryzen / Chipset relationship:
We just published our final video walkthrough of iBUYPOWER’s ongoing “Project Snowblind” enclosure, which uses an NZXT Noctis 450 and custom LCD side panel assemblage. The setup has been in our coverage for several months now, starting with PAX Prime in September, followed by an office visit in October (with several upgrades), and now concluding with CES 2017.
In its simplest form, the Snowblind enclosure offers an LCD side panel (rather than traditional case side panel) which is capable of graphics playback or Rainmeter overlay. Really, it can do anything that an extra monitor could do, it’s just limited by visibility and contrast. The Snowblind uses all white/black internals to ensure the side panel’s output remains as legible as possible, and further uses ultra-bright LEDs along the inside wall of the side panel to provide the effective “backlight” for the display. iBUYPOWER is using an expansion slot in the case to host a small card that bridges comms between a DVI link (from the GPU), but the card does not use any motherboard slots. A simple DVI pass-through runs from the video card to the expansion card, which then runs the wiring to the LCD side panel.