In additional hardware news to what we published yesterday -- a look at Intel's Kaby Lake (7600K, 7700K, etc.), the X2 Empire unique enclosure, and Logitech's G Pro mouse -- we are today visiting topics of Samsung's GDDR6, SK Hynix's HBM3 R&D, PCIe Gen4 power budget, and Zen's CCX architecture.
The biggest news here is Samsung's GDDR6, due for 2018, but it's all important stuff. PCI-e Gen4 is looking at being fully ratified EOY 2016, HBM3 is in R&D, and Zen is imminent and finalized architecturally. We'll talk about it more specifically in our reviews.
Update: Tom's misreported on PCI-e power draw. The Gen4 PCIe interface will still be 75W.
Anyway, here's the news recap:
Memory manufacturer Samsung is developing GDDR6 as a successor to Micron's brand new GDDR5X, presently only found in the GTX 1080 and Titan XP cards. GDDR6 may feel like a more meaningful successor to GDDR5, though, which has been in production use since 2008.
In its present, fully matured form, GDDR5 operates at 8Gbps maximally, including on the RX 480 and GTX 10 series GPUs. Micron demonstrated GDDR5X as capable of approaching 12-13Gbps with proper time to mature the architecture, but is presently shipping the memory in 10Gbps speeds for the nVidia devices.
Samsung indicates an operating range of approximately 14Gbps to 16Gbps on GDDR6 at 1.35V, coupled with lower voltages than even GDDR5X by using LP4X. Samsung indicates a power reduction upwards of 20% with post-LP4 memory technology.
Samsung is looking toward 2018 for production of GDDR6, giving GDDR5X some breathing room yet. As for HBM, SK Hynix is already looking toward HBM3, with HBM2 only presently available in the GP100 Accelerator cards. HBM3 will theoretically run a 4096-bit interface with upwards of 2TB/s throughput, at 512GB/s per stack. We'll talk about this tech more in the semi-distant future.
Tom's Hardware this week reported on the new PCI Express 4.0 specification, primarily detailing a push toward a minimum spec of 300W power transfer through the slot, but could be upwards of 500W. Without even talking about the bandwidth promises – moving to nearly 2GB/s for a single lane – the increase of power budget will mean that the industry could begin a shift away from PCI-e cables. The power would obviously still come form the power supply, but would be delivered through pins in the PCI-e slots rather than through an extra cable.
This same setup is what allows cards like a 750 Ti to function only off the PCI-e slot, because the existing spec allows for 75W to push through the PCIe bus. PCI-e 4.0 should be ratified by the end of 2016 by the PCI-SIG team, but we don't yet know the roll-out plans for consumer platforms.
AMD also detailed more of its Zen CPU architecture, something we talked about last week when the company camped out near IDF for an unveil event. The Summit Ridge chips have primarily been on display thus far, showing an 8C/16T demo with AMD's implementation of SMT, but we haven't heard much about other processors.
AMD is ditching modules in favor of CPU Complexes, or a CCX, each of which will host four CPU cores. Each CCX runs 512KB of L2 Cache per core, as seen in this block diagram, with L3 sliced into four pieces for 8MB total low-order address interleave cache. AMD says that each core can communicate with all cache on the CCX, and promises the same latency for all accesses.
It looks like the lowest SKU chips will still be quad-cores at a minimum.
Host: Steve "Lelldorianx" Burke
Video: Andrew "ColossalCake" Coleman
This week following IDF has posted several news items for general computing technology and for product announcements. As one might expect, Intel unveiled more Kaby Lake information at its self-titled "Intel Developer Forum," and OCaholic posted a SKU listing for the new Kaby Lake CPUs up to the 7700K. Our news round-up video discusses the limited specifications of the i5-7600K, i7-7700K, lower TDP chips, and Intel's plans for launch.
We also look to the world of peripherals for the Logitech G Pro mouse, equipped with the PMW3366 sensor, and to the world of cases for X2's new "Empire" enclosure.
More in the video or script below, if you prefer:
Despite AMD’s FreeSync arriving later than nVidia’s G-Sync, FreeSync has seen fairly widespread adoption, especially among gaming monitors. The latest monitor – and the 101st – to officially support FreeSync is Lenovo’s Y27f. This also marks the announcement of Lenovo’s first FreeSync monitor.
This week's Ask GN episode answers viewer questions about FinFET vs. Planar, the impact of cooling on power consumption, CPU load for 120Hz / 144Hz displays, liquid cooler testing, and a few extras. We spend most the time talking liquid coolers and cooler testing – a fitting topic, having done multiple “Hybrid” video card builds lately.
The full list of questions with their timestamps can be found below the video. Thanks to our viewers for the questions and, as always, post more in the video comments on YouTube for inclusion in next week's episode.
German manufacturer Be Quiet! has released its latest line of ultra-quiet fans – the SilentWings 3, first found in the Dark Base 900 that we saw at Computex. Be Quiet! is a company whose name backs most product roll-outs, as representative Christoph Katzer explained to us. The company focuses heavily on build quality and silence, and the new SilentWings 3 fans have been redesigned with fluid-dynamic bearings, now using brass cores and seven blades that have a funnel-shaped design. The frame is rubberized to enable a reported near-inaudible sound level – according to Be Quiet!, the 120mm model produces 16.4 decibels and the 140mm model 15.5 decibels. To put that into perspective, someone whispering is about 30 decibels. The rubberized design also reduces vibration levels to further mitigate noise.
We looked at Be Quiet!'s Dark Base 900 PC case at Computex and were impressed. The SilentWings 3 fans debuted in the DB900, about 3 months prior to launch individually, so owners of the DB900 are already equipped with the new fans.
MSI has announced it will be releasing five new GTX 1060 3GB cards. The new Pascal video cards are set for an August release, and they will take on AMD’s 4GB RX 480 in the $200 - $250 market. The MSRP for the GTX 1060 3GB cards will be $200, but some cards may be priced higher to account for pre-overclocks and AIB partner value adds, like improved cooling.
The GTX 1060 3GB cards have 1152 CUDA cores, operating at a base clock of 1506MHz and a boost clock of 1708MHz – the same as the 6GB model, but with 128 fewer cores. MSI, like other AIB partners, will offer factory overclocked cards coupled with brand heatsinks.
There were rumors of a GTX 1060 3GB card, but the launch of the GTX 1060 featured a single 6GB model. Almost exactly one month later, nVidia has announced its 3GB GTX 1060 with 1152 CUDA Cores, down from 1280, and a halved framebuffer. The card will also run fewer TMUs as a result of disabling 1 SM, for a total of 9 simultaneous multiprocessors versus the 10 SMs on the GTX 1060 6GB. This brings down TMU count from 80 to 72 (with 8x texture map units per SM), making for marginally reduced power coupled with a greatly reduced framebuffer.
(Update: The card is already available on etailers, see here.)
In theory, this will most heavily impact 0.1% low and 1% low frame performance, as we showed in the AMD RX 480 8GB vs. 4GB comparison. Games which rely less upon Post FX and more heavily upon large resolution textures and maps (as in shadow, normal, specular – not as in levels) will most immediately show the difference. Assassin's Creed, Black Ops III (in some use cases), and Mirror's Edge Catalyst are poised to show the greatest differences between the two. NVidia has advertised an approximate 5% performance difference when looking at the GTX 1060 3GB vs. GTX 1060 6GB, but that number will almost certainly be blown out when looking at VRAM stressing titles.
While Intel's Developer Forum is underway in San Francisco, not far from AMD in Sunnyvale, the x64 creators held a press conference to demonstrate Zen CPU performance. Based strictly on the presentation, AMD shows a 40% IPC (Instructions Per Clock) over Vishera. The demonstration used a 16T processor, the “Summit Ridge” chip that's been discussed a few times, which runs 8 cores with simultaneous multi-threading (SMT) for 16 total threads. For the non-gaming market, CPU codename “Naples” was also present, a 32C/64T Zen server processor in a dual-CPU Windows server.
AMD detailed more of the Zen architecture in an official capacity, commenting on new caching routines and branch prediction, accompanied by the SMT changes that shift AMD away from its modular Bulldozer architecture. AMD made mention of “fanless 2-in-1s” in addition to high-performance CPUs and embedded systems.
Pascal has mobilized, officially launching in notebooks today. The GTX 1080, 1070, and 1060 full desktop GPUs will be available in Pascal notebooks, similar to the GTX 980 non-M launch from last year. Those earlier 980 laptops were a bit of an experiment, from what nVidia's laptop team told us, and led to wider implementation of the line-up for Pascal.
We had an opportunity to perform preliminary benchmarks using some of our usual test suite while at the London unveil event, including frametime analysis (1% / 0.1% lows) with Shadow of Mordor. Testing was conducted using the exact same settings as we use in our own benchmarks, and we used some of our own software to validate that results were clean.
Before getting to preliminary GTX 1080 & GTX 1070 notebook FPS benchmarks on the Clevo P775 and MSI GT62, we'll run through laptop overclocking, specification differences in the GTX 1070, and 120Hz display updates. Note also that we've got at least three notebooks on the way for testing, and will be publishing reviews through the month. Our own initial benchmarks are further down.
Recapping some of the most recent hardware news for the past two days, we visit topics centering on liquid cooling for video cards and a side topic discussing Micron's newest 32GB mobile 3D NAND.
For GPUs, ZOTAC has just announced its “ArcticStorm” GTX 1080 card with waterblock, providing full coverage over the VRAM, FETs, and GPU itself. Standard G1/4 threaded fittings include barbs to support 10mm inner diameter tubing, and microfins are spaced at 0.3mm apart. For a more visual understanding of microfins and spacing, check our liquid cooler tear-down. A metal backplate is included with the card.
We don't have a price on Zotac's ArcticStorm just yet, but have reached-out to ask.