Hardware news this week is largely focused on new product launches, or rumors thereof, with additional coverage of Intel's plans to launch 10nm Ice Lake CPUs in some capacity (for real, this time) by end of year. The XFX RX 5700 XT "THICC" was leaked -- yes, that's a real name -- and it's accompanied by other partner model cards coming out in the next week.
Show notes continue after the embedded video.
This week's hardware news was filmed prior to our trip to Vancouver for LTX, which we're covering in a lot of content pieces coming up. HW News discusses CCX overclocking, 3nm and 5nm process progress, DRAM revenue dropping hard, and industry topics like Origin's sale to Corsair. We also talk about 5.2GHz 3900X overclocking results, but that'll be in the video only for this one. The rest is in the written section below, as always.
Hardware news for this week is a bit sluggish, with Amazon’s Prime Day -- and the ensuing unrepentant consumerism -- seeming to occupy more than its share of headlines this week. Still, we’ve curated some of the more interesting stories including the latest report from Digitimes and an elucidating interview where Intel CEO Robert Swan cites being “too aggressive” as a key factor in Intel’s CPU shortage. Other topics include information on AMD’s Arcturus GPUs and what form they could take, a Toshiba Memory rebrand, and NZXT adding to its pre-built machines catalog.
In recent GN news, we’ve delved ever further into Ryzen 3000 and the Zen 2 architecture, including a deep dive into AMD’s Precision Boost Overdrive algorithm, looking at how Ryzen 3000 frequencies scale with temperature, and our R9 3900X overclocking stream.
GN just notched one of its busiest weeks ever, thanks to relentless product launches from AMD and Nvidia. We’ve recently reviewed Nvidia's RTX 2070 Super and RTX 2060 Super, in addition to AMD’s Ryzen 5 3600, Ryzen 9 3900X, and Radeon RX 5700 XT. We also have multiple videos further analyzing Ryzen 3000 boost clocks and the RX 5700 XT cooling solution.
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For mostly non-AMD related news this week, Intel has announced multiple new technologies focused on chip packaging, in addition to hiring a new CCO in Claire Dixon. MSI is updating its AM4 400-series of motherboard to include a larger BIOS chip, there’s a new PCIe 4.0 SSD coming, with a presumably cheaper 500GB capacity, and we’re expecting custom Navi cards in August. The news stories follow the video embed, per the usual.
Although we're at the end of the hardest testing cycle we've ever had, with many nights spent sleeping in the office (if sleeping at all), we're not even close to the end of it. There'll be follow-up and additional product testing throughout the next week, and that's all because of the joint launches of NVIDIA Super and AMD Navi GPUs, mixed in most importantly with AMD Ryzen 3000-series CPUs. New architectures take the longest to test, predictably, as everything we know has to be rebenchmarked to establish new behaviors in the processors. Anyway, with all of that, there's still news to cover. Show notes are after the embed.
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