Patrick Lathan

Patrick Lathan

The NZXT H710 is a slight refresh of the H700 that we reviewed two years ago. To be precise, we reviewed the Smart Device-equipped H700i, but NZXT did us the favor of sending us the base version this time. The appearance and features of the case are almost identical to the original H700, so we’ll focus on cataloguing any minor changes and seeing how the H700 case design holds up in 2019.

We never reviewed the Corsair 460X, but now we are reviewing the Corsair iCUE 465X. It's good that we never reviewed the first case, because we’re thoroughly tired of trying to find new things to say about case revisions when we’ve just gotten through looking at the prior one. The 465X is a familiar design with a full-length PSU shroud and tempered glass side and front panels, but with open-air gaps on either side that so many case manufacturers seem afraid to commit to. Corsair's 465X is priced similarly to the NZXT H700 non-i, Cooler Master H500P Mesh, and Lian Li O11 Dynamic after fan purchases. Pricing is supposed to be in the $150-$160 range, with some impact assuredly from tariffs and the rest from the RGB LEDs, three fans, and cut-down Node internally.

The Phanteks P400A gave us tentative hope at Computex when we saw its move to a fine mesh front panel, similar to what Cooler Master did with the NR600. The P400A follows-up on the original Eclipse P400, but while keeping the base tooling, it massively overhauls the panel design to move away from a closed-off, suffocated front and toward a more open mesh. Phanteks also avoids the trap that many fall into by eliminating a dust filter, instead relying on the fine mesh as a filter and keeping airflow as open as possible. In today’s testing, we’ll look at the Phanteks P400A RGB for thermals and acoustics, but we’ll also test the white panel versus black panel to see if the paint thickness matters, then throw the original P400 panel on for comparison.

The original Phanteks Eclipse P400 released circa 2016. The P400 is a case that launched during the initial explosion of S340-esque cases with sealed front panels, full-length PSU shrouds, and no optical drive support. Phanteks has gotten an impressive amount of use out of that tooling over the years, most recently with the case we’re reviewing today: the mesh-fronted P400A that comes as a $70 base model with two fans and a fan controller or a $90 RGB model with three fans and an LED controller. We’ll be covering the $70 model in a separate piece, since this review is already full to the brim with testing of the P400A’s front panel.

Memory speed on Ryzen has always been a hot subject, with AMD’s 1000 and 2000 series CPUs responding favorably to fast memory while at the same time having difficulty getting past 3200MHz in Gen1. The new Ryzen 3000 chips officially support memory speeds up to 3200MHz and can reliably run kits up to 3600MHz, with extreme overclocks up to 5100MHz. For most people, this type of clock isn’t achievable, but frequencies in the range of 3200 to 4000MHz are done relatively easily, but then looser timings become a concern. Today, we’re benchmarking various memory kits at XMP settings, with Ryzen memory DRAM calculator, and with manual override overclocking. We’ll look at the trade-off of higher frequencies versus tighter timings to help establish the best memory solutions for Ryzen.

One of the biggest points to remember during all of this -- and any other memory testing published by other outlets -- is that motherboard matters almost more than the memory kit itself. Motherboards are responsible for most of the timings auto configured on memory kits, even when using XMP, as XMP can only store so much data per kit. The rest, including unsurfaced timings that the user never sees, are done during memory training by the motherboard. Motherboard manufacturers maintain a QVL (Qualified Vendor List) of kits tested and approved on each board, and we strongly encourage system builders to check these lists rather than just buying a random kit of memory. Motherboard makers will even tune timings for some kits, so there’s potentially a lot of performance lost by using mismatched boards and memory.

The O11 Dynamic was a case we liked enough to keep around for housing one of our work PCs. The layout is nonstandard, from the side intake vents to the placement of the PSU and storage, but it works. It may be the only case we’ve ever tested with a completely sealed-off glass front panel that still managed to perform actually well in testing. The O11 Air variant impressed us somewhat less, but improved substantially when the dust filtration was removed. Now, in 2019, Lian Li is introducing the O11 XL, a larger version of the original case, still bearing the Der8auer badge for his initial work on the O11 Dynamic. 

Like the Dynamic, this case is meant to be used for water cooling builds, but our standardized test bench is used for air testing. This is still useful to determine the performance capabilities of the case, as it’ll all scale when comparing one case to the next, but note that water cooling can obviously brute-force its way past a lot of thermal issues. Still, the O11 Dynamic made an actually good air-cooled case thanks to the bottom intake and side intake options, so even though it looks best as an aquarium, it didn’t have to be one.

We moderate comments on a ~24~48 hour cycle. There will be some delay after submitting a comment.


  VigLink badge