Steve started GamersNexus back when it was just a cool name, and now it's grown into an expansive website with an overwhelming amount of features. He recalls his first difficult decision with GN's direction: "I didn't know whether or not I wanted 'Gamers' to have a possessive apostrophe -- I mean, grammatically it should, but I didn't like it in the name. It was ugly. I also had people who were typing apostrophes into the address bar - sigh. It made sense to just leave it as 'Gamers.'"
First world problems, Steve. First world problems.
Der8auer just delidded his high core-count Skylake-X CPU (12C to 18C), using the same kit that we used in our i9-7900X delidding video from Computex. Der8auer’s findings reveal a larger die than the 10C 7900X that we previously delidded, though the 12-18C units are ultimately using a die with disabled cores from the higher-end Xeon line. The delid also teaches us, critically, that even the 7920X CPUs are still not soldered. This isn’t necessarily a surprise, seeing as Intel’s operation has avoided soldering for the other recent CPUs, but we’re hoping that future Intel product lines move back to solder. Der8auer hasn't posted his findings of the 18C parts yet, so there is still room for a change -- but solder is looking unlikely.
EVGA’s booth was among the few hardware exhibitors carrying new product at PAX West. The company’s DG-7 series is finally nearing completion, now going on a year of press coverage, and has one final round of showings prior to a November launch. With that final round, EVGA has begun showing white and white/black two-tone versions of the high-end DG-77. The tooling is the same, it’s just a matter of color preference.
The DG-77 was on show again at PAX West, now in white, and included some semi-finalized specifications for November launch. The DG-77 should likely include four fans – we’re not sure on sizes, but probably 120mm – with support for 280mm front radiators (potentially up to 360mm, unconfirmed) and 240mm top radiators. A single rear exhaust port is also available at 120mm, and likely will be populated stock. The case market is competitive enough right now to demand a $100-$130 price range on the enclosure, but EVGA hasn’t finalized pricing just yet.
Thermals and noise to align with final launch.
There were a lot of challenges going into this build: A lack of magnetism, a lack of lighting on the show floor of a convention center, and some surprises in between. Cooler Master allowed us to build in the brand-new Cosmos C700P case – a modular chassis with an invertible or rotatable motherboard tray – live at PAX West. After being faced with some challenges along the way, we recruited Cooler Master’s Wei Yang to turn it into a collaborative team build. It was one of the most fun builds we’ve done in a while, and the pressure of time meant that we were both taking turns dropping screws and reworking our aspects of the build. This was a real PC build. There were unplanned changes, parts that GN hasn’t used before, and sacrifices made along the way.
All said and done, the enclosure is exceptionally easy to work within: Every single panel can be removed with relative ease, so we were able to strip-down the case to barebones for the build. Our biggest timesink was asking to invert the motherboard tray to face the other side, since that’d add some flare to the build. This process isn’t intrinsically difficult, but it does require removal of a lot of screws – after all, the entire case can be flipped, and there are a lot of structural elements there. The motherboard tray detaches by removing 4-6 screws on the back-side, followed by six screws in the rear of the case, followed by a few more screws for the shrouds. We got some help for this process, as the case is one of the first working samples of the Cosmos C700P and there’s not yet a manual for which screws have to be removed.
(The video for this one is a read-through of this article -- same content, just read to you.)
Going hands-on at PAX West 2017, we stopped by Logitech’s booth to get more technical details on the Logitech G613 wireless keyboard, G603 wireless mouse, and some follow-up information on the PowerPlay mat and G903/G703 mice. The latter set of information will go live in our pending-publication review. The former is up for discussion today.
Both devices leverage the same wireless hardware used in the G900 mouse, which we previously reviewed and found to perform equivalently or superior to high-end wired mice. The myth of “wireless is always slower” was immolated by that product series, mummified and entombed alongside other black magic gamer peripheral mythology. The G613 is the first high-performance wireless keyboard that we’re aware of, levying Logitech’s Romer G switches (which feel similar to o-ring damped browns) and two modes of wireless connectivity. These include Bluetooth and Logitech’s now-standard high-performance wireless setup, dubbed “Lightspeed.” Interestingly, these two systems can be used asynchronously to create an ad-hoc KVM, switching to wireless for the high-performance machine (e.g. gaming box), then Bluetooth for the accompanying streaming box or compression machine. This, we think, is the most marketable feature of the G613, and so happens to also exist on the new G603.
Everyone talks game about how they don’t care about power consumption. We took that comment to the extreme, using a registry hack to give Vega 56 enough extra power to kill the card, if we wanted, and a Floe 360mm CLC to keep temperatures low enough that GPU diode reporting inaccuracies emerge. “I don’t care about power consumption, I just want performance” is now met with that – 100% more power and an overclock to 1742MHz core. We've got room to do 200% power, but things would start popping at that point. The Vega 56 Hybrid mod is our most modded version of the Hybrid series to date, and leverages powerplay table registry changes to provide that additional power headroom. This is an alternative to BIOS flashing, which is limited to signed drivers (like V64 on V56, though we had issues flashing V64L onto V56). Last we attempted it, a modified BIOS did not work. Powerplay tables do, though, and mean that we can modify power target to surpass V56’s artificial power limitation.
The limitation on power provisioned to the V56 core is, we believe, fully to prevent V56 from too easily outmatching V64 in performance. The card’s BIOS won’t allow greater than 300-308W down the PCIe cables natively, even though official BIOS versions for V64 cards can support 350~360W. The VRM itself easily sustains 360W, and we’ve tested it as handling 406W without a FET popping. 400W is probably pushing what’s reasonable, but to limit V56 to ~300W, when an additional 60W is fully within the capabilities of the VRM & GPU, is a means to cap V56 performance to a point of not competing with V64.
We fixed that.
AMD’s CU scaling has never been that impacting to performance – clock speed closes most gaps with AMD hardware. Even without the extra shaders of V64, we can outperform V64’s stock performance, and we’ll soon find out how we do versus V64’s overclocked performance. That’ll have to wait until after PAX, but it’s something we’re hoping to further study.
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