Steve started GamersNexus back when it was just a cool name, and now it's grown into an expansive website with an overwhelming amount of features. He recalls his first difficult decision with GN's direction: "I didn't know whether or not I wanted 'Gamers' to have a possessive apostrophe -- I mean, grammatically it should, but I didn't like it in the name. It was ugly. I also had people who were typing apostrophes into the address bar - sigh. It made sense to just leave it as 'Gamers.'"
First world problems, Steve. First world problems.
Prior to the Computex rush, we stopped by Lian Li’s case manufacturing facility in Taiwan, about 30 minutes outside of Taipei. A near-future content piece will show our tour of the case factory (and detail how cases are made), but for today, we’re talking about the products for Computex. Other than pushing RGB to the next level – namely by attaching it to cables – Lian Li also provided us an opportunity to look at an updated O11 Air and Lancool One.
We first saw the Lian Li O11 Air at CES 2018, then reviewed the O11 Dynamic after that, and we’re now approaching launch for the Air variant. The Lian Li O11 Air has gone through spec finalization, with a target of $130 for a 3-fan model, or $150 for a 6-fan model (which is highly competitive, we think). The O11 Dynamic was more focused on water cooling, but the O11 Air goes for large, plastic paneling with grills cut throughout, with otherwise identical tooling to the O11 Dynamic. We think this enclosure is one of the most interesting for the latter half of this year. It’s presently due for “before August, probably,” with a possibility of a July launch.
With B350, B360, Z370, Z390, X370, and Z490, we think it’s time to revisit an old topic answering what a chipset is. This is primarily to establish a point of why we need clarity on what each of these provides – there are a lot of chipsets with similar names, different socket types, and similar features. We’re here to define a chipset today in TLDR fashion, with a later piece to explain the actual chipset differences.
As for what a chipset actually is, this calls back to a GN article from 2012 – though we can do a better job now. The modern chipset is a glorified I/O controller, and can be thought of as the spinal cord of the computer, while the CPU is the disembodied brain. Intel calls its chipset a PCH, or Platform Controller Hub, while AMD just goes with the generic and appropriate term “chipset.” The chipset is the center of I/O for the rest of the motherboard, assigning I/O lanes to devices like SATA, gigabit ethernet, and USB ports.
Cooler Master’s H500M is the 18th addition to our “Cases Named H500” chart. The H500M was shown at CES 2018, and follows-up the initial H500P, the H500P Mesh, and the unrelated H500 and H500i cases from NZXT. This is Cooler Master’s high-end solution, shipping at $200 and including user-swappable glass or mesh front panels, with the mesh panel pre-installed in a default configuration. Today, we’re reviewing the Cooler Master H500M enclosure.
Cooler Master’s H500M officially launches for product availability to consumers in the second week of June, just after Computex ends, and carries an MSRP of $200. For clarity, this is a different product than the H500P Mesh that we previously reviewed, although it does ship with a mesh front by default. The H500M also includes a swappable glass front, and otherwise primarily differentiates itself with additional gloss and ARGB support and controllers.
From the ARGB side, software is still to come, and immediate compatibility includes ASUS motherboards. Cooler Master is working with other vendors on further integration. For our purposes today, we’re more focused on overall build quality and thermal performance; besides, we’ve got Computex and flights to Asia breathing down our necks, so we’ll stick with what we’re good at.
Our colleagues at Hardware Canucks got a whole lot of hate for their video about switching back to Intel, to the point that it really shows the profound ignorance of being a blind fanboy of any product. We decided to run more in-depth tests of the same featureset as Dmitry, primarily for selfish reasons, though, as we’ve also been considering a new render machine build. If HWC’s findings were true, our plans of using an old 6900K would be meaningless in the face of a much cheaper CPU with an IGP.
For this testing, we’re using 32GB of RAM for all configurations (dual-channel for Z/X platforms and quad-channel for X399/X299). We’re also using an EVGA GTX 1080 Ti FTW3 for CUDA acceleration – because rendering without CUDA is torturously slow and we’re testing for real-world conditions.
Adobe recently added IGP-enabled acceleration to its Premiere video editing and creation software, which seems to leverage a component that is often irrelevant in our line of work – the on-die graphics processor. This move could potentially invalidate the rendering leverage provided by the likes of a 7980XE or 1950X, saving money for anyone who doesn’t need the additional threads for other types of work (like synchronous rendering or non-Premiere workstation tasks, e.g. Blender). Today, we’re benchmarking Adobe Premiere’s rendering speed on an Intel i7-8700X, AMD R7 2700X, Intel i9-7980XE, and AMD Threadripper 1950X.
Some new rumors have indicated an nVidia GPU launch in “late July,” which correspond with our previous GDDR6 timelines putting us in July-September for a launch date. Our long-standing estimate has been August to September for the most probable launch window. We’d still plant it in August, but Tom’s seems to be reporting late July.
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