Steve started GamersNexus back when it was just a cool name, and now it's grown into an expansive website with an overwhelming amount of features. He recalls his first difficult decision with GN's direction: "I didn't know whether or not I wanted 'Gamers' to have a possessive apostrophe -- I mean, grammatically it should, but I didn't like it in the name. It was ugly. I also had people who were typing apostrophes into the address bar - sigh. It made sense to just leave it as 'Gamers.'"
First world problems, Steve. First world problems.
NVIDIA’s GTX 1650 was sworn to secrecy, with drivers held for “unification” reasons up until actual launch date. The GTX 1650 comes in variants ranging from 75W to 90W and above, meaning that some options will run without a power connector while others will focus on boosted clocks, power target, and require a 6-pin connector. GTX 1650s start at $150, with this model costing $170 and running a higher power target, more overclocking headroom, and potentially better challenging some of NVIDIA’s past-generation products. We’ll see how far we can push the 1650 in today’s benchmarks, including overclock testing to look at maximum potential versus a GTX 1660. We’re using the official, unmodified GTX 1650 430.39 public driver from NVIDIA for this review.
We got our card two hours before product launch and got the drivers at launch, but noticed that NVIDIA tried to push drivers heavily through GeForce Experience. We pulled them standalone instead.
ASUS grew impatient waiting for Samsung to reach volume production on its 32GB DDR4 UDIMMs, and so the company instead designed a new double capacity DIMM standard. This isn’t a JEDEC standard, but is a standard that has gotten some attention from ZADAK and GSkill, both of whom have made some of the tallest memory modules the world has seen. These DIMMs are 32GB per stick, so two of them give us 64GB at 3200MHz and, after overclocking effort, some pretty good timings. Two of these sticks would cost you about $1000, with the 3600MHz options at $1300. Today, we’ll be looking into when they can be used and how well they overclock.
These are double-capacity DIMMs, achieved by making the PCB significantly taller than ordinary RAM. More memory fits on a single stick, making it theoretically possible to approach the max of the CPU’s memory controller. This is difficult to do, as signal integrity starts to become threatened as the PCB grows larger and more complex.
This GN Special Report looks at years of sales data from which CPUs our viewers and readers have purchased. The focus is our audience, and so we’re looking at Intel versus AMD sales volume and, to some extent, marketshare in the enthusiast segment of GN content consumers. Our data looks at average selling price (or ASP) of CPUs, the most popular CPU models and change over a 3.5-year period, and the overall sales volume between Intel and AMD across 4Q16 to 1Q19.
AMD has undoubtedly gained marketshare over the past two years. Multiple factors have aligned for AMD, the most obvious of which is its own architectural innovation with the Zen family of processors. Secondary to this, Intel’s inability to keep up with 14nm demand has crippled its DIY processor availability, with a third hit to Intel being its unexpected and continual delays to 10nm process. It was the perfect storm for AMD: Just one of these things would have helped, but all three together have allowed the company to claw itself back from functionally zero sales volume in the DIY enthusiast space.
Asetek has a stranglehold on most of the closed-loop liquid cooler market for PC hardware, easily holding majority placement in all CLCs sold in the US. CoolIT has long been a contender of Asetek’s, with the two having battled legally over Asetek’s patents on pump-in-block design, and has also been one of Corsair’s two liquid cooling partners. Both Asetek and CoolIT make the Corsair liquid coolers, though the latter fell out of popularity for a number of years. Finally, with the Platinum line, Corsair is working with CoolIT in a mainstream product. The H115i Platinum uses a new pump and block design, and that’s something we’ll show off thoroughly in our upcoming liquid cooler internals comparison video. For today, we’re focusing on reviewing the $160 H115i Platinum for thermals, acoustics, and overall value at the price point.
Asetek has previously received settlements in legal disputes against CoolIT, the other supplier of Corsair’s closed-loop liquid coolers, and has also won legal battles against Cooler Master for its Seidon series. Asetek, it seems, has a patent on the pump-in-block design approach, and has had judges rule in its favor. This has led to an exodus of non-Asetek coolers in the US market, with companies like Swiftech and Be Quiet! pulling their similarly-made (but non-Asetek) coolers out of the US market. We’re left with a few braver souls, like those using Apaltek-made designs, and some companies that have worked around the patents. DeepCool would be an example, which uses a three-chamber, very complicated approach to its pump manufacturing.
This is the article version of our recent tour of a cable factory in Dongguan, China. The factory is SanDian, used by Cooler Master (and other companies you know) to manufacture front panel connectors, USB cables, Type-C cables, and more. This script was written for the video that's embedded below, but we have also pulled screenshots to make a written version. Note that references to "on screen" will be referring to the video portion.
USB 3.1 Type-C front panel cables are between 4x and 10x more expensive than USB2.0 front panel cables, which explains why Type-C is still somewhat rare in PC cases. For USB 3.1 Gen2 Type-C connectors with fully validated speeds, the cost is about 7x as expensive as the original USB3.0 cables. That cost is all because of how the cables are made: Raw materials have an expense, but there’s also tremendous time expense to manufacture and assemble USB 3.1 Type-C cables. Today’s tour of SanDian, a cable factory that partners with Cooler Master, shows how cables are made. This includes USB 3.1 Type-C, USB 2.0, and front panel connectors. Note that USB 3.1 is being rebranded to USB 3.2 going forward, but it’s the same process.
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