Hardware Guides

We've previously written in great detail about the SSD development lifecycle and SSD manufacturing processes, but we've yet to delve into what really drives solid-state drives: Controllers. An SSD is effectively its own, self-contained computer-within-a-computer. It's got a CPU-equivalent in the form of a Flash Storage Processor (or Controller), complete with on-board cache, memory management, low-level firmware, and channels to the NAND Flash modules.

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Because an SSD's Flash Storage Processor is effectively a specialized, purpose-built CPU, we'll limit this article to a few key, top-level aspects of controllers; we'll break the controller's numerous complex elements into several individual articles, with this one focusing on overprovisioning, write amplification factor, and video content.

Overprovisioning and Write Amplification Factor (WAF) were selected as our key topics for a few reasons: First, WAF plays a massive role in the longevity of the NAND Flash as it ages, directly impacting the usable life of the drive; second, the overprovisioned space on a drive dictates the available user space and performance. When helping our system builders select an SSD, our two most common questions have been "What's the endurance like?" and "Why is the capacity different between competing drives? Why is one 256GB and the other 240GB?" This article answers both of those questions.

Let's hit the video content first:

A significant aspect of any silicon engineering lifecycle is chip post-mortem, providing engineers with insight to a chip's inadequacies and specific points of failure; as the manufacturing process continues to decrease in physical size (we're nearing sub-20nm on most commercial microprocessors), increasingly powerful scopes are required to analyze internal electrical defects.

nvidia-systemThis is how nVidia does system building: A custom Danger Den box outfitted with custom sleeving and lighting.

NVidia Silicon Technology Failure Analysis Director Howard Marks gave us a walkthrough of some of the lab's multimillion-dollar analytical tools, seen in the video below. If this sort of content interests you, we'd also recommend checking out our recent walkthrough of Kingston's automated SMT lines and shipping robotics facilities.

We recently visited Kingston Technologies' headquarters in Fountain Valley, CA, where we were able to tour on-site production facilities and talk about RAM & SSD assembly. Most of our time was spent exploring labs and wandering through the aisles of SMT lines, finally concluding with a trip to the shipping robotics and packaging room. This article and accompanying video give an insider walkthrough of SMT lines and the memory testing & assembly process, providing a bit of insight as to "how it's made."

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Anyone producing board-mounted hardware (memory, motherboards, video cards) is using SMT lines (Surface-Mount Technology) at some point in the process. SMT lines use largely standardized, industry-wide machinery to assemble a product, solder components to it, electrically test the product, and eventually spit out the unit for shipping and/or further testing. Because SMT lines are standardized, they can be configured to produce multiple types of products -- the same lines that produce RAM can also be used for motherboards (though are configured differently).

Kingston Senior Technology Manager Mark Tekunoff gave us a walkthrough of the SMT lines and packaging machinery in their Fountain Valley, California facilities; the SMT lines weren't in operation when we were there, unfortunately, but we still show the equipment and Tekunoff explains how it all works. The packaging robotics (toward the end of the video) are in full operation and are quite cool to see in action, so definitely check those out.

As an aside, you may find our previous collaborative effort with Kingston/LSI of interest, which explains the design-dev-test-fab lifecycle of an SSD.

As part of our extended stay in California, we were able to visit MSI's City of Industry headquarters and get a walkthrough of all their upcoming and released gaming products. A number of you have posted questions on our forums pertaining to gaming laptops lately, and appropriately, we spent the most time looking at MSI's large selection of gaming portables.

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Let's get right to it, starting with an overview of some high-end gaming notebooks, then moving to MSI's new "Stealthy" GS70 system. We're looking at MSI's GE40, GE70, GT70 Dragon Edition 2, GX70, and GS70 gaming laptop specs and offering some hands-on impressions; let us know in the comments below if you've got questions.

We previously published an article that gave a top-level overview of motherboard selection for new PC builds. In this year's revised edition, we'll approach the topic with a bit more depth than previously and will account for Intel's Haswell CPUs and AMD's FX line of CPUs.

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Selecting the best motherboard for your gaming PC build is important to ensure upgradability going forward, access to Haswell/AMD overclocking features, and overall system stability. Chipset selection is tied-at-the-hip with motherboard selection, but if you need help finding the right chipset, check out these previous two articles (Intel - Haswell; AMD - FX).

Toward the final steps of silicon fabrication, individual dies and NAND Flash modules are tested for frequency and voltage tolerance, among other things; the stability (or volatility) of the silicon chip is gauged within a spec range, then the factory bins-out the chip for use in specific product lines. Some chips outperform the target spec, some underperform - this talks about what's done with those units.

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This article will discuss the process of binning-out silicon dies and Flash modules for use in your hardware. Silicon is not created equal, so some units will perform noticeably better than others, and some will far-and-away exceed their expectations. The goal here is to explain why certain products (K-SKU OC editions, for instance) have a higher threshold for frequency and voltage tolerance, have higher overall stability, and run at more thermally-sound temperatures. Is this information going to make your computer faster? No, but it's cool to know, and more importantly, it can inform your purchasing decisions in the future.

Let's dive into it!

In continuing our Haswell coverage (following up from our "is Haswell worth it for gaming?" post), today we visit the topic of the CPU's most intimate counterpart: the Chipset. As more of you begin to evaluate the place for 4th Gen Intel components in your upcoming PC builds, it's important to understand the various chipsets and their inherent use case scenarios. If you're brand new to all of this and aren't even 100% sure what a chipset is, check out this previous article: "What is a Chipset, Anyway?"

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Intel's previous generational tick (IvyBridge), known as the 3rd Gen Intel Cores, operated on the LGA1155 socket with 7-series chipsets. You're all familiar with Z77, Z75, and H77 chipsets at this point, but with the Haswell drop comes the 8-series ("Lynx Point") of chipsets -- and Intel has made a good deal of changes, especially for power and voltage regulation.

In this article, we'll compare Intel's Z87, H87, and H81 Haswell chipsets, talk about the differences, and evaluate what you need for your machine. Let's talk about the major differences between Intel's new family members.

Haswell's officially been out of embargo/NDA for a few days now, TigerDirect has launched its product offerings, and the internet is abuzz about Intel's 4th Gen processors. After reading through the vast majority of reviews on the web, comparing benchmark results, and studying specs, overclocking, and potential shortcomings, we've built up enough confidence to officially comment on the abounding "is Haswell worth it?" question.

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As always, Intel's released around a dozen SKUs of their new CPU, two of which are K-SKU OC chips, the rest are scattered between S-series powersaving or no-suffix "casual" computing. Everything looks great on paper:

AMD's APUs have proliferated with ferocity over the past year or so; now making up about 75% of the company's total chip sales, AMD seems to be investing more seriously in what was previously considered a niche market. We don't suspect just APU sales could support a monolithic company like AMD (at least, not in its current form), but the recent launch of the PS4 and impending promise of an AMD APU-driven Steam Box and Xbox could mean good things for the company.

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We were told at CES by AMD representatives that Steam Box would be operating on A6 and A8 APUs and the PS4 has been officially stated to include a semi-custom Jaguar 8-core APU (heavily INT-optimized with a large-width FPU); the Trinity APUs run a bit too hot for console purposes, making Jaguar a reasonable choice for what have effectively become living room PCs. Let's start this PS4 hardware specs analysis with the APU—Jaguar—and the PS4's top-level specs. We'll then talk about what implications these have on PC gaming and console gaming.

Update: See the CES 2014 edition of this article here.

Update: Our new Buyer's Guide for gaming cases was recently posted. Check out both guides for the biggest case selection range.

CES 2013 was a killer show for enthusiast and mid-range system builders, and with all of the great new content we've posted in the past week, we decided it's time to write a round-up. This post looks at all of the best gaming PC cases due for release in 2013, as revealed at CES. For those looking for advice on how to choose the best computer case for your needs, view our "How to Choose a Gaming Case" article.

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We'll specifically look at mid-tower and full-tower cases here, but a post (by popular request) covering mini-ITX and mATX HTPC-grade cases will follow. Let's get to the products and photos!

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