Running through the entire Skylake X lineup with TIM vs. liquid metal benchmarking means we’ve picked-up some very product-specific experience. Skylake X has a unique substrate composition wherein the upper substrate houses the silicon and some SMDs, with the lower substrate hosting the pads and some traces. This makes delidding unique as well, made easier with Der8auer’s Delide DieMate X (available in the US soon). This tutorial shows how to delid Intel Skylake X CPUs using the DieMate X, then how to apply liquid metal. We won't be covering re-sealing today.
Still, given the $1000-$2000 cost with these CPUs, an error is an expensive one. We’ve put together a tutorial on the delid and liquid metal application process.
Disclaimer: This is done entirely at your own risk. You assume all responsibility for any damage done to CPUs. We will do our best to detail this process so that you can safely follow our steps, and following carefully will minimize risk. Ultimately, the risk exists primarily in (1) applying too much force or failing to level the CPU, both easily solved, or (2) applying liquid metal in a way that shorts components.
There are many reasons that Intel may have opted for TIM with their CPUs, and given that the company hasn’t offered a statement of substance, we really have no exact idea of why different materials are selected. Using TIM could be a matter of cost – as seems to be the default assumption – and spend, it could be an undisclosed engineering challenge to do with yields (with solder), it could be for government or legal grants pertaining to environmental conscientiousness, or related to conflict-free advertisements, or any number of other things. We don’t know. What we do know, and what we can test, is the efficacy of the TIM as opposed to alternatives. Intel’s statement pertaining to usage of TIM on HEDT (or any) CPUs effectively paraphrases as “as this relates to manufacturing process, we do not discuss it.” Intel sees this as a proprietary process, and so the subject matter is sensitive to share.
With an i7-7700K, TIM is perhaps more defensible – it’s certainly cheaper, and that’s a cheaper part. Once we start looking at the 7900X and other CPUs of a similar class, the ability to argue in favor of Dow Corning’s TIM weakens. To the credit of both Intel and Dow Corning, the TIM selected is highly durable to thermal cycling – it’ll last a long time, won’t need replacement, and shouldn’t exhibit any serious cracking or aging issues in any meaningful amount of time. The usable life of the platform will expire prior to the CPU’s operability, in essence.
But that doesn’t mean there aren’t better solutions. Intel has used solder before – there’s precedent for it – and certainly there exist thermal solutions with greater transfer capabilities than what’s used on most of Intel’s CPUs.
Today's video showed some of the process of delidding the i9-7900X -- again, following our Computex delid -- and learning how to use liquid metal. It's a first step, and one that we can learn from. The process has already been applied toward dozens of benchmarks, the charts for which are in the creation stage right now. We'll be working on the 7900X thermal and power content over the weekend, leading to a much greater content piece thereafter. It'll all be focused on thermals and power.
As for the 7900X, the delid was fairly straight forward: We used Der8auer's same Delid DieMate tool that we used at Computex, but now with updated hardware. A few notes on this: After the first delid, we learned that the "clamp" (pressing vertically) is meant to reseal and hold the IHS + substrate still. It is not needed for the actual delid process, so that's one of the newly learned aspects of this. The biggest point of education was the liquid metal application process, as LM gets everywhere and spreads sufficiently without anything close to the size of 'blob' you'd use for TIM.
Taking apart EVGA's GTX 1080 Ti FTW3 Hybrid isn't too different from the process for all the company's other cards: Two types of Phillips head screws are used in abundance for the backplate, the removal of which effectively dismantles the entire card. Wider-thread screws are used for the shroud, with thinner screws used for areas where the backplate is secured to front-side heatsinks (rather than the plastic shroud).
That's what we did when we got back from our PAX trip -- we dismantled the FTW3 Hybrid. We don't have any immediate plans to review this card, particularly since its conclusions -- aside from thermals -- will be the same as our FTW3 review, but we wanted to at least have a look at the design.
Before PAX Prime, we took apart the Logitech G903 mouse and wireless charging station, known as “Powerplay.” The G903 mouse can socket a “Powerplay module” into the weight slot, acting as one of two coils to engage the magnetic resonance charging built into the underlying powerplay mat. Magnetic resonance and inductive charging have been around since Nikola Tesla was alive, so it’s not new technology – but hasn’t been deployed in a mainstream peripheral implementation. Laptops have attempted various versions of inductive charging in the past (to varying degrees of success), and phones now do “Qi” charging, but a mouse is one of the most sensible applications. It’s also far lower power consumption than something like a laptop, and so doesn’t suffer as much for the inefficiencies inherent to wireless charging.
AMD’s architecture hasn’t generally shown a large gain from increasing CU count between top-tier and second-to-top cards. The Fury and Fury X, for instance, could be made to match with an overclock on the lower-tiered card. Additional gains on the higher-tiered card often amount from the increased power limit and clock, not from a straight shader increase. We’re putting that knowledge to the test on Vega architecture, equalizing the Vega 56 & Vega 64 clocks (and 945MHz HBM2 clocks) to determine how much of a difference emerges from the 4096 shaders on V64 to 3584 shaders on V56. Purely counting shaders, that’s a 14% increase to V64, but like most performance metrics, that won’t result in a linear performance increase.
We were able to crush Vega 64’s performance with our heavily modded Vega 56 card, using powerplay tables and liquid to jump to 1742MHz clock speeds. That's with modding, though, and isn't out-of-box performance -- it also doesn't give us any indication as to shader differences. Going less crazy about overclocking and limiting clocks to matched speeds, we can reveal the shader count difference.
Thermals and noise to align with final launch.
There were a lot of challenges going into this build: A lack of magnetism, a lack of lighting on the show floor of a convention center, and some surprises in between. Cooler Master allowed us to build in the brand-new Cosmos C700P case – a modular chassis with an invertible or rotatable motherboard tray – live at PAX West. After being faced with some challenges along the way, we recruited Cooler Master’s Wei Yang to turn it into a collaborative team build. It was one of the most fun builds we’ve done in a while, and the pressure of time meant that we were both taking turns dropping screws and reworking our aspects of the build. This was a real PC build. There were unplanned changes, parts that GN hasn’t used before, and sacrifices made along the way.
All said and done, the enclosure is exceptionally easy to work within: Every single panel can be removed with relative ease, so we were able to strip-down the case to barebones for the build. Our biggest timesink was asking to invert the motherboard tray to face the other side, since that’d add some flare to the build. This process isn’t intrinsically difficult, but it does require removal of a lot of screws – after all, the entire case can be flipped, and there are a lot of structural elements there. The motherboard tray detaches by removing 4-6 screws on the back-side, followed by six screws in the rear of the case, followed by a few more screws for the shrouds. We got some help for this process, as the case is one of the first working samples of the Cosmos C700P and there’s not yet a manual for which screws have to be removed.
(The video for this one is a read-through of this article -- same content, just read to you.)
Everyone talks game about how they don’t care about power consumption. We took that comment to the extreme, using a registry hack to give Vega 56 enough extra power to kill the card, if we wanted, and a Floe 360mm CLC to keep temperatures low enough that GPU diode reporting inaccuracies emerge. “I don’t care about power consumption, I just want performance” is now met with that – 100% more power and an overclock to 1742MHz core. We've got room to do 200% power, but things would start popping at that point. The Vega 56 Hybrid mod is our most modded version of the Hybrid series to date, and leverages powerplay table registry changes to provide that additional power headroom. This is an alternative to BIOS flashing, which is limited to signed drivers (like V64 on V56, though we had issues flashing V64L onto V56). Last we attempted it, a modified BIOS did not work. Powerplay tables do, though, and mean that we can modify power target to surpass V56’s artificial power limitation.
The limitation on power provisioned to the V56 core is, we believe, fully to prevent V56 from too easily outmatching V64 in performance. The card’s BIOS won’t allow greater than 300-308W down the PCIe cables natively, even though official BIOS versions for V64 cards can support 350~360W. The VRM itself easily sustains 360W, and we’ve tested it as handling 406W without a FET popping. 400W is probably pushing what’s reasonable, but to limit V56 to ~300W, when an additional 60W is fully within the capabilities of the VRM & GPU, is a means to cap V56 performance to a point of not competing with V64.
We fixed that.
AMD’s CU scaling has never been that impacting to performance – clock speed closes most gaps with AMD hardware. Even without the extra shaders of V64, we can outperform V64’s stock performance, and we’ll soon find out how we do versus V64’s overclocked performance. That’ll have to wait until after PAX, but it’s something we’re hoping to further study.
We’re revisiting an old topic. A few years ago, we posted an article entitled “How Many Watts Does a Gaming PC Really Need,” which focused on testing multiple configurations for power consumption. We started working on this revisit last week, using a soon-to-be-released Bronze 450W PSU as a baseline, seeing as we’ve recently advocated for more 400-450W PSUs in PC builds. We'll be able to share more about this PSU (and its creator and name) soon. This content piece shows how far we can get on lower wattage PSUs with modern hardware.
Although we’ll be showing an overclocked 7700K + GTX 1080 FTW as the high-end configuration, we’d recommend going higher than 450W for that particular setup. It is possible to run on 450W, but we begin pushing the continuous load on the PSU to a point of driving up noise levels (from the PSU fan) and abusing the power supply. There’s also insufficient headroom for 100% GPU / 100% CPU workloads, but that should be uncommon for most of our audience. Most the forum builds we see host PSUs ranging from 700-800W+, which is often overkill for most modern gaming PCs. You’d want the higher capacity for something like Threadripper, for instance, or X299, but those are HEDT platforms. For gaming platforms, power requirements largely stop around 600W, sans serious overclocking, and most systems can get by lower than that.
Since AMD’s high-core-count Ryzen lineup has entered the market, there seems to be an argument in every comment thread about multitasking and which CPUs handle it better. Our clean, controlled benchmarks don’t account for the demands of eighty browser tabs and Spotify running, and so we get constant requests to do in-depth testing on the subject. The general belief is that more threads are better able to handle more processes, a hypothesis that would increasingly favor AMD.
There are a couple reasons we haven’t included tests like these all along: first, “multitasking” means something completely different to every individual, and second, adding uncontrolled variables (like bloatware and network-attached software) makes tests less scientific. Originally, we hoped this article would reveal any hidden advantages that might emerge between CPUs when adding “multitasking” to the mix, but it’s ended up as a thorough explanation of why we don’t do benchmarks like this. We’re using the R3 1200 and G4560 to primarily run these trials.
This is the kind of testing we do behind-the-scenes to build a new test plan, but often don’t publish. This time, however, we’re publishing the trials of finding a multitasking benchmark that works. The point of publishing the trials is to demonstrate why it’s hard to trust “multitasking” tests, and why it’s hard to conduct them in a manner that’s representative of actual differences.
In listening to our community, we’ve learned that a lot of people seem to think Discord is multitasking, or that a Skype window is multitasking. Here’s the thing: If you’re running Discord and a game and you’re seeing an impact to “smoothness,” there’s something seriously wrong with the environment. That’s not even remotely close to enough of a workload to trouble even a G4560. We’re not looking at such a lightweight workload here, and we’re also not looking at the “I keep 100 tabs of Chrome open” scenarios, as that’s wholly unreliable given Chrome’s unpredictable caching and behaviors. What we are looking at is 4K video playback while gaming and bloatware while gaming.
In this piece, the word “multitasking” will be used to describe “running background software while gaming.” The term "bloatware" is being used loosely to easily describe an unclean operating system with several user applications running in the background.
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