We've learned the following key properties for peak thermal performance with a delid:
- On dual-substrate HCC CPUs, we've found that scraping the lower layer of silicone adhesive from the substrate, then both layers of silicone adhesive on the IHS, yields the best thermal results. We recommend leaving the upper layer of adhesive on the upper substrate, as it acts as a guiding mechanism for re-application of the IHS, and helps to align the re-mount. We've found that removing this layer doesn't impact thermals more than 1-3 degrees Celsius, which is very close to error margins.
- We've found that applying liquid metal on both the IHS and CPU die is required, as the surface tension of liquid metal will result in limited contact without LM applied on both sides.
- We've learned that resealing the IHS is best done with very light and sparing application of silicone adhesive, primarily around the corners of the lower substrate (apply direct to IHS), and around the outer edge of the IHS. For our own CPUs, we do not re-seal, but we re-seal them for the other YouTubers, as the CPUs must endure shipping. We've found that resealing at all will increase reported temperatures a bit, but not in a way which negates the obvious advantage of being sealed -- namely, being able to move it, turn it vertically, and ship it.
This next delid should be done soon, and will go live on Tech Source's channel sometime thereafter.
As for our primary content, we've got a short film intro to tomorrow's video, and we're very excited to show it all off.
Stay tuned!
- Steve.
