Manufacturing a single case can cost hundreds of thousands of dollars to design and develop, but the machinery used to make those cases costs millions of dollars. In a recent tour of Lian Li’s case manufacturing facility in Taiwan, we got to see first-hand the advanced and largely autonomous hydraulic presses, laser cutters, automatic shaping machines, and other equipment used to make a case. Some of these tools apply hundreds of thousands of pounds of force to case paneling, upwards of 1 million Newtons, and others will use high voltage to spot-weld pieces to aluminum paneling. Today, we’re walking through the start-to-finish process of how a case is made.
The first steps of case manufacturing at the Lian Li facility is to design the product. Once this process is done, CAD files go to Lian Li’s factory across the street to be turned into a case. In a simplified, canonical view of the manufacturing process, the first step is design, then raw materials and preparation of raw materials, followed by either a laser cutter for basic shapes or a press for tooled punch-outs, then washing, grinding, flattening, welding, and anodizing.
We visited EVGA’s suite for a look at the new OC Robot and built-in BIOS stress testing update for the X299 Dark motherboards. For the new X299 Micro 2 motherboard, we also learned the following of the VRM spec:
- VCCIN : IR35201(Controller1 - 5PH double to 10PH) + IR3556 x10
- VSA+VCCIO : IR35204(Controller2 - 1+1PH) + IR3556 (1+1)
- VSM+VPP_C01 : IR35204(Controller3 - 1+1PH) + TDA88240 (1+1)
- VSM+VPP_C23 : IR35204(Controller4 - 1+1PH) + TDA88240 (1+1)
After seeing dozens of cases at Computex 2018, we’ve now rounded-up what we think are the best cases from the show, with the most interesting design elements, price points, or innovations. As always, wait until we can review these cases before getting too hyped and pre-ordering, but we wanted to at least point-out the top cases to pay attention to for the next year.
We’re calling this content the “Most Room for Improvement at Computex 2018” content piece. A lot of products this year are still prototypes, and so still have lots of time to improve and change. Many of the manufacturers have asked for feedback from media and will be making changes prior to launch, hopefully, but we wanted to share some of our hopes for improvement with all of you.
Separately, Linus of LinusTechTips joined us for the intro of this video, if that is of interest.
Our Computex 2018 coverage continued as we visited the BeQuiet! booth. This year, Be Quiet! announced the new Dark Rock Pro for socket TR4 (Threadripper), timely for Threadripper 2, and also showed a trio of refreshed cases -- the Silent Base 801, 601, and Dark Base 900 Rev 2.0.
The Dark Rock Pro TR4 is specifically designed with AMD’s Threadripper socket TR4 in mind. The Dark Rock Pro’s only real difference from previous iterations is the new full coverage block for Threadripper. The new cold plate is designed to help ensure full die coverage on Threadripper, which we discussed back in August of last year. We’ve previously found there to be a measurable difference when using TR4 full coverage coolers vs. non-TR4 ones. Price and release date were not available at this time.
Computex 2018 saw the unveil of pro overclocker Der8auer’s phase-change cooling solution, called the Phase-Shift Cooler, using a similar solution to 3M Novec. Novec coolant has been demonstrated before (and was again at Computex) for its low boiling point and ability to cool a system using “only” a condenser and coolant, but is on the restricted substances list in the EU for containing PFCs. This eliminates 3M Novec from the list of products available for consumer retail, and forced Der8auer and Caseking to find another solution. The pair did find another liquid with a low boiling point, but did not share with GamersNexus the specs of the liquid. Regardless, it’s the same idea.
For Der8auer’s Phase-Shift Cooler, about 40ml of liquid sits in a CPU block, attached via (presently) a large hose to a condenser and tank. Atop a 7920X with Prime95 running, roughly creating about a 140W heat load, the coolant evaporates and drafts up the pipe as a gas. As the gas hits the tank, it encounters the condensers and gets cooled by a pair of copper heatsinks and 90mm fans. Once condensation forms, it slowly drips back down the tube and returns to the block.
At EVGA’s headquarters in New Taipei City, Taiwan, GamersNexus received a hands-on overview of the company’s new semi-closed loop liquid nitrogen cooling setup. The setup was created by K|NGP|N and TiN, both of whom work in the Taiwan office, to increase overclocking efficiency and reduce LN2 usage to only necessary quantities. Typically, extreme overclocking involves manual pouring of liquid nitrogen (LN2) from a thermos, which the overclocker can either manually refill from the LN2 tanks or can refill from the exhaust. With this new system, K|NGP|N is able to circulate LN2 based upon software input of desired temperatures, with used LN2 getting pushed through a series of flexible steel tubing and out of an exit manifold. The result yields somewhat reusable LN2 and eliminates the hands-on thermos pouring element of XOCing, allowing overclockers to focus on the result and tuning. Theoretically, you could run off of large LN2 tanks (~180L) at conservative temperatures for weeks on end, then swap tanks and use the collected “runoff.”
Rumors and speculation around Intel’s Core i7-8086K have begun to grow in large part due to listings on retail websites. The rumored i7-8086K is likely Intel’s way of commemorating their 40th anniversary of their 8086 CPU, a 16-bit processor released on June 8th, 1978.
The i7-8086K (6C/12T) was listed at two different frequencies of 4.0GHz and 5.0GHz. The 5GHz model was listed on Connection.com for $489.83, an increase of $139.94 over the i7-8700K at the time of writing. Despite rumors, GN has been told by multiple sources that the 8086K will not be a soldered CPU, but instead will use TIM.
Prior to the Computex rush, we stopped by Lian Li’s case manufacturing facility in Taiwan, about 30 minutes outside of Taipei. A near-future content piece will show our tour of the case factory (and detail how cases are made), but for today, we’re talking about the products for Computex. Other than pushing RGB to the next level – namely by attaching it to cables – Lian Li also provided us an opportunity to look at an updated O11 Air and Lancool One.
We first saw the Lian Li O11 Air at CES 2018, then reviewed the O11 Dynamic after that, and we’re now approaching launch for the Air variant. The Lian Li O11 Air has gone through spec finalization, with a target of $130 for a 3-fan model, or $150 for a 6-fan model (which is highly competitive, we think). The O11 Dynamic was more focused on water cooling, but the O11 Air goes for large, plastic paneling with grills cut throughout, with otherwise identical tooling to the O11 Dynamic. We think this enclosure is one of the most interesting for the latter half of this year. It’s presently due for “before August, probably,” with a possibility of a July launch.
With B350, B360, Z370, Z390, X370, and Z490, we think it’s time to revisit an old topic answering what a chipset is. This is primarily to establish a point of why we need clarity on what each of these provides – there are a lot of chipsets with similar names, different socket types, and similar features. We’re here to define a chipset today in TLDR fashion, with a later piece to explain the actual chipset differences.
As for what a chipset actually is, this calls back to a GN article from 2012 – though we can do a better job now. The modern chipset is a glorified I/O controller, and can be thought of as the spinal cord of the computer, while the CPU is the disembodied brain. Intel calls its chipset a PCH, or Platform Controller Hub, while AMD just goes with the generic and appropriate term “chipset.” The chipset is the center of I/O for the rest of the motherboard, assigning I/O lanes to devices like SATA, gigabit ethernet, and USB ports.
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