This week's hardware news recap covers an Intel document leaked to GN, detailing H370, B360, & other launches, alongside coverage of the Zen+ & Zen 2 launches, AIB partner Vega cards, and memory kit releases. The last bit of coverage shows the new 4500 & 4600MHz memory kits that have primarily emerged from Corsair, though other vendors are following suit with new memory kit launches. GSkill, for instance, is pushing more "Ryzen-ready" memory kits in the RGB line, focusing mostly on the 3200MHz speeds that were largely shipped to reviewers. GeIL is working on RGB memory kits that synchronize with ASUS Aura RGB lighting effects for motherboards and video cards.
As for video card news, we confirmed with MSI that the company presently has limited or no plans for Vega partner model cards. Gigabyte plans to make cards, but the launch date is tenuous -- as is ASUS' launch date, at this point, as both vendors are working out final issues in manufacturing. We'd wager that it's primarily to do with supply availability, though VBIOS + driver challenges also exist.
Running through the entire Skylake X lineup with TIM vs. liquid metal benchmarking means we’ve picked-up some very product-specific experience. Skylake X has a unique substrate composition wherein the upper substrate houses the silicon and some SMDs, with the lower substrate hosting the pads and some traces. This makes delidding unique as well, made easier with Der8auer’s Delide DieMate X (available in the US soon). This tutorial shows how to delid Intel Skylake X CPUs using the DieMate X, then how to apply liquid metal. We won't be covering re-sealing today.
Still, given the $1000-$2000 cost with these CPUs, an error is an expensive one. We’ve put together a tutorial on the delid and liquid metal application process.
Disclaimer: This is done entirely at your own risk. You assume all responsibility for any damage done to CPUs. We will do our best to detail this process so that you can safely follow our steps, and following carefully will minimize risk. Ultimately, the risk exists primarily in (1) applying too much force or failing to level the CPU, both easily solved, or (2) applying liquid metal in a way that shorts components.
No surprise in that headline, really.
Some of this information is rehashed, but has been bulked-up by alleged AMD slides leaked to Informatica Cero. The slides, which are functionally in “rumor” status, indicate AMD’s code-named Matisse processors as launching in 2019. The Matisse CPUs will carry AMD’s Zen 2 architecture, but aim to continue supporting AM4 platforms. Before that launch, AMD’s Zen Plus iteration is targeted for 2018, allegedly, and will exist primarily as an optimization on the existing Ryzen CPUs. This can be thought of as an analog to the retired Intel tick-tock cadence, with Zen Plus likely targeting frequency tuning.
Our 7900X delidding benchmarks weren’t published by coincidence: Today, we’re expanding on our liquid metal vs. Intel TIM testing with the new Intel i9-7960X and i9-7980XE CPUs, the 16C and 18C Skylake-X parts, respectively. These CPUs are Intel’s highest multithreaded performers in this segment, and are priced alongside that status – the 7960X costs $1700, with the 7980XE at $2000.
Rather than focusing entirely on delidding and thermal benchmarks, we’ll also be including power testing and some production benchmarks (Blender, Premiere). This review of the Intel i9-7960X and i9-7980XE will primarily test thermals, power, delidded thermals, liquid metal thermals, rendering benchmarks, and some synthetics.
Recapping the previous test approach for delidding & liquid metal:
Intel moved-up its news embargo lift for the new Coffee Lake CPU products (“8th Gen Core” processors) following publication of the entire news announcements on leak websites. The news for today pertains to the product stack specifications – at least, as it’s relevant to our audience – and finalizes official listings and prices for the i7-8700K, i7-8700, i5-8600K, i5-8400, i3-8350K, and i3-8100.
First up, the 1K unit pricing of the Intel i7-8700K, the successor to the i7-7700K, will land at $360. This isn’t too distant from previous Intel 1K unit prices for i7 CPUs, though does creep the price about $10-$20 more than the final street price of the 7700K (near launch, anyway). The pricing here, assuming it does land at around $360 USD in North America, could prove reasonable for the CL CPUs. We’ll find out in testing, and will reach a verdict for the review. In the meantime, though, it seems that the rumored $400+ pricing may not come to fruition.
There are many reasons that Intel may have opted for TIM with their CPUs, and given that the company hasn’t offered a statement of substance, we really have no exact idea of why different materials are selected. Using TIM could be a matter of cost – as seems to be the default assumption – and spend, it could be an undisclosed engineering challenge to do with yields (with solder), it could be for government or legal grants pertaining to environmental conscientiousness, or related to conflict-free advertisements, or any number of other things. We don’t know. What we do know, and what we can test, is the efficacy of the TIM as opposed to alternatives. Intel’s statement pertaining to usage of TIM on HEDT (or any) CPUs effectively paraphrases as “as this relates to manufacturing process, we do not discuss it.” Intel sees this as a proprietary process, and so the subject matter is sensitive to share.
With an i7-7700K, TIM is perhaps more defensible – it’s certainly cheaper, and that’s a cheaper part. Once we start looking at the 7900X and other CPUs of a similar class, the ability to argue in favor of Dow Corning’s TIM weakens. To the credit of both Intel and Dow Corning, the TIM selected is highly durable to thermal cycling – it’ll last a long time, won’t need replacement, and shouldn’t exhibit any serious cracking or aging issues in any meaningful amount of time. The usable life of the platform will expire prior to the CPU’s operability, in essence.
But that doesn’t mean there aren’t better solutions. Intel has used solder before – there’s precedent for it – and certainly there exist thermal solutions with greater transfer capabilities than what’s used on most of Intel’s CPUs.
MSI is still building GTX 1080 Ti models, it seems. The Pascal 1080 Ti series has to be one of the most prolific AIB partner cards in a long time: EVGA has an insurmountable catalogue, at this point, ASUS and Gigabyte branched-out 1080 Ti units, and MSI is now adding a triple-fan cooler that seems to be taking some of Zotac's style.
The new MSI GTX 1080 Ti Gaming X Trio will join the company's existing line of cards, including the Gaming X, Gaming Z, Lightning X, Lightning Z, Seahawk, et al. The Gaming X Trio switches from "Twin Frozr" to a triple-fan cooler, using two fans of larger size (they look to be 90mm, maybe 100mm) and one of smaller size, located centrally. Unlike some of the competition, all three fans spin in the same direction and use the same blade design, just different sizes.
Traveling once again, so just a quick update for everyone: Linus of Linus Tech Tips revealed on his WAN show tonight that we’d be making a guest appearance in an upcoming Tech Showdown series refresh, alongside other panelists iJustine and “Keys” from NCIXTechTips. Limited further information was given on the series at this time, but we’ll make another post once there’s more to know.
In the meantime, we joined Linus briefly on the WAN show to discuss topics of Coffee Lake and Ice Lake, alongside some general industry discussion:
We’ve received a lot of requests from readers to review the Fractal Meshify C, and rightfully so. The case combines three things we’ve liked a lot recently: mesh front panels, tempered glass, and the Fractal Define C. We’ve been advocating cases with this style of cooling for a while now, like the SilverStone RL06, and so we had to put the Meshify through its paces in some real thermal tests.
Fractal’s naming system is getting a little cluttered: the Meshify C is 100% a Define C TG with an angular, “stealth-inspired” front panel that looks “like black diamond facets” (according to Fractal). It is a cool look, and it breaks away from the current trend of plain, flat front panels in a way that’s reminiscent of the Corsair SPEC-04. “C” is the model and Meshify is the series; Define cases focus on noise suppression, while Meshify cases (there’s only one so far) focus on cooling.
Our review of the Fractal Meshify C tests the case for thermals, noise suppression, and performance versus the Define C (and other cases). The Fractal Meshify C can be found on Amazon here, with the Define C here, just so we’re all on the same page.
This review will focus almost entirely on noise and thermals. There’s not much point to discussing ease of installation or build features, as all of those were already covered in our Define C review. The tooling is identical, nearly, it just comes down to the paneling. View our Define C review for the other half of the information.
Today's video showed some of the process of delidding the i9-7900X -- again, following our Computex delid -- and learning how to use liquid metal. It's a first step, and one that we can learn from. The process has already been applied toward dozens of benchmarks, the charts for which are in the creation stage right now. We'll be working on the 7900X thermal and power content over the weekend, leading to a much greater content piece thereafter. It'll all be focused on thermals and power.
As for the 7900X, the delid was fairly straight forward: We used Der8auer's same Delid DieMate tool that we used at Computex, but now with updated hardware. A few notes on this: After the first delid, we learned that the "clamp" (pressing vertically) is meant to reseal and hold the IHS + substrate still. It is not needed for the actual delid process, so that's one of the newly learned aspects of this. The biggest point of education was the liquid metal application process, as LM gets everywhere and spreads sufficiently without anything close to the size of 'blob' you'd use for TIM.
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