Razer is pulling the curtains on a pair of high-end gaming mice: the wireless Razer Lancehead and the wired Razer Lancehead Tournament Edition. Razer touts the new mice as being “tournament-grade” in terms of accuracy, performance, and reliability. The two variants of the Razer Lancehead share many features: the sensor and Razer’s proprietary “Adaptive Frequency Technology” are the chief modifiers.
The wireless Razer Lancehead—much like the refreshed Diamondback and high-end Mamba series—uses a 5G laser sensor with up to 50g acceleration and 16,000 DPI/210 inches per second tracking. The refreshed Diamondback and Mamba/Mamba TE all used a Philips Twin Eye sensor. It is unclear if that is the case with the Razer Lancehead, but given the specs, it’s plausible.
AMD’s taken a page out of nVidia’s book, apparently, and nVidia probably took that page from Apple – or any number of other companies that elect to re-use product names. The new Radeon Pro Duo uses the same name as last year’s launch, but has updated the internals.
We’ve been one of the most active in modding newly-launched GPUs with “hybrid” cooling solutions, and even recently began running thermal tests on VRM components alongside said mods. Before we ever did hybrid mods, NZXT launched its G10 bracket – back in 2013 – to tremendous success and adoption. That adoption died off over time, mostly due to new GPU launches that weren’t clear on compatibility, and NZXT eventually was met by competition from Corsair’s HG10.
This week’s episode of Ask GN (#48!) talks CUDA core vs. Stream Processor differences at a top level, cooling suppliers, right to repair laws, and more.
The cooling supplier question is an interesting one: A user wondered what differences a manufacturer – someone like Corsair, NZXT, or others – might actually make when purchasing a semi-custom solution from a supplier. While it is possible to buy an off-the-shelf solution from the likes of Asetek, CoolIT, Apaltek, and others, the more common option is to customize the solution to some extent. This can be as low-level as instituting an entirely new PCB (see: Kraken series) or can be higher level, like tube length and pump flowrate.
Learn more in the video:
While we crank away at finalizing the review for the GTX 1080 Ti Gaming X, the Ryzen R5 CPUs, and some other products, we decided to run a PCB & VRM quality analysis of MSI’s card. The new GTX 1080 Ti Gaming X is another in a line of overbuilt VRMs, but interesting for a number of reasons (especially given the quality of this round’s reference VRM).
In our analysis of the PCB, we go over VRM design, overclocking potential, and power mods. The power mod section (toward the end of the video) discusses shunt shorting and how to trick the GPU into permitting a higher power throughput than natively allowed.
View Buildzoid’s analysis below:
AMD today made available a power plan update which should change how the Balanced plan impacts Ryzen performance.
Problems with Windows preset power modes have been one of the biggest annoyances with Ryzen, and AMD has officially recommended the High Performance preset in the past in order to avoid subpar performance in benchmarks. This wasn’t a big deal from a testing point of view since High Performance mode effectively avoids all of these issues, but for everyday use, it was: High Performance mode doesn’t allow CPU frequency to drop when idle, and the additional power consumption can really hurt the long-term value of the system (it’s also just wasteful). Balanced mode does drop frequency, but it’s also been overly aggressive with core parking on Ryzen chips specifically, making it sub-optimal for use. We discussed what this looks like from a user’s point of view in our “Just Research” article, where frequency plots offer visualization for the impact of Performance vs. Balanced mode. The same article contains some FPS benchmarks between the two power modes.
AMD has made two major changes in this update. Quoting their statement:
Maintain residency in CPU p0 or p1 to give Zen full control over clocks and volts.
Disable core parking.
They specifically noted that Intel also fully disables core parking in the Balanced power plan. Our tests have always used High Performance mode for Ryzen platforms (except power tests), and our results will not be affected by this update.
On the heels of the media world referring to the Titan X (Pascal) as Titan XP – mostly to reduce confusion versus the previous Titan X – nVidia today announced its actual Titan Xp (lowercase ‘p,’ very important) successor to the Titan XP. Lest Titan X, Titan X, and Titan X be too confusing, we’ll be referring to these as Titan XM [Maxwell], Titan X (Pascal), and Titan Xp. We really should apologize to Nintendo for making fun of their naming scheme, as nVidia seems to now be in competition; next, we’ll have the New Titan Xp (early 2017).
Someone at nVidia is giddy over taking the world’s Titan XP name and changing it, we’re sure.
Radeon Software Crimson Edition version 17.4.1 is now live. Along with some bug fixes, the bulk of this release is additional VR support.
AMD is making good on their promise to support asynchronous reprojection for both Oculus Rift and SteamVR. Oculus’ “Asynchronous Spacewarp” is now usable on R9 Fury, 290 and 390 series cards, while SteamVR’s “Asynchronous Reprojection” is usable on RX 480 and 470s with Windows 10.
This 47th episode of Ask GN features questions pertaining to test execution and planning for multitasking benchmarks, GPU binning, Ryzen CPU binning, X300 mITX board availability, and more. We provide some insights as to plans for near-future content, like our impending i7-2600K revisit, and quote a few industry sources who answered questions in this week's episode.
Of note, we worked with VSG of Thermal Bench to talk heatpipe size vs. heatpipe count, then spoke with EVGA and ASUS about their GPU allocation and pretesting processes (popularly, "binning," though not quite the same). Find the new episode below, with timestamps to follow the embed:
We recently covered Intel’s DC P4800X data center drive, with takes on the technology from two editors in video and article form. Those content pieces served as a technology overview for 3D Xpoint and Intel Optane (and should be referenced as primer material), but both indicated a distinct lack of any consumer-focused launch for the new half-memory, half-storage amalgam.
Today, we’re back to discuss Intel’s Optane Memory modules, which will ship April 24 in the form of M.2 sticks.
As Intel’s platform for 3D Xpoint (Micron also has one: QuantX), Optane will be deployed on standardized interfaces like PCI-e AICs, M.2, and eventually DIMM form factors. This means no special “Optane port,” so to speak, and should make adoption at least somewhat more likely. There’s still a challenging road ahead for Intel, of course, as Optane has big goals to somewhat unify memory and storage by creating a device with storage-like capacities and memory-like latencies. For more of a technology overview, check out Patrick Stone’s article on the DC P4800X.
We moderate comments on a ~24~48 hour cycle. There will be some delay after submitting a comment.