We're traveling for an event today, which means the bigger review and feature content is on hold until we're back in the lab.
The last few days have yielded enough intrigue and hardware news to warrant a separate content piece, anyway. AMD and nVidia, as usual, have largely stolen the show with head-to-head events on February 28, working to snipe coverage from one another. Also on the video card front, JPR reports that add-in board sales have increased for 4Q16, and that attach rate of AIB cards to systems has increased year-over-year. Somewhat related, new RX 460 cards from MSI offer a half-height form factor option (pricing TBD) with the 896 core version of the Polaris 11 chip.
We’ve got a lot of Ryzen news confirmations leading into the product’s inevitable launch, and will today be focusing on the stock coolers, ASUS X370 motherboards, and die shots of the Ryzen architecture.
And there’ll be more soon, of course!
We previously noted that some motherboards at CES contained text indicating support for an AMD “S3.0 Radiator,” which we could then only assume would be a stock cooler bundled with high-end Ryzen CPUs. This was plainly on display at CES, though we couldn’t get any official information on the cooler from AMD.
This episode of Ask GN focuses on addressing questions about temperatures, liquid cooling, and air cooling, though does include one question about multi-channel platforms for memory. For something different, the beginning of the episode features a surprise package from NZXT, who’ve lately set to antagonizing us with pucks, and the episode concludes with video clips from our convention adventures.
There’s a of fun stuff in this episode, but as always, we’re not able to really get into the weeds with each individual topic. We go fairly deep on some of the thermal stuff, but there’s a lot more that could be discussed. The multi-channel question, for example, doesn’t account for changes in the world of DDR4 and new platforms. We’ll have to test that at some point.
Timestamps after the embedded video.
We’re on to Episode 43 of Ask GN, which means we’ve past 42 – which means that the we missed the perfect opportunity to answer questions about “life, the universe, and everything.” Ah, well.
In episode 43, we’re talking skills to figure out if your CPU is bottlenecking your GPU (or vice versa), laptop thermal refurbishment (copper shims, thermal pads, thermal paste), and more. A good few minutes of the video is spent addressing a question about “Temporal Filtering,” one of the new-ish settings that’s been in a few Ubisoft games lately. Watch Dogs 2 most recently makes use of Temporal Filtering. We define that here.
For written content today, check out our revised WD Blue vs. Black vs. Red guide that defines Western Digital’s rainbow of hard drives. It’s been updated a bit since our original piece.
At the tail-end of a one-day trip across the country, this episode of Ask GN tides us over until our weekend burst of further content production. We’re currently working on turning around a few case reviews, some game benchmarks, and implementing new thermal calibrators and high-end equipment.
In the meantime, this episode addresses questions involving “doubled” DRAM prices, delidding plans for the i7-7700K, contact between a heatsink and the back of a video card, and a few other topics. Check back posthaste as we’ll ramp into publication of our i5-7600K review within the next day.
Video below, timestamps below that:
German manufacturer be quiet! has launched an update to the Pure Power series of entry-level PSUs: the Pure Power 10 and Pure Power 10 CM models (CM for “Cable Management”). We previously covered the new Pure Power PSUs at CES last year, where it was revealed that the series would be moving to 80 Plus Silver certification (for models at and above 400W) and that the cables would be changed to solid black by popular demand. In speaking with be quiet! at that CES meeting, we also learned that silver-rated PSUs are rough listing on Newegg, since there are so few of them; folks sorting by 80 Plus rating often skip over Silver.
The 300 and 350W supplies have one PCIe connector, 400-500 have two, and 600W+ have four. Modular cables are low-profile and fixed cables are (black) sleeved.
Our latest episode of Ask GN talks CPU IHS inclusion, delidding, RAM overclocking, some other tech questions, and a new trial GN shirt. We also talk about and demonstrate the audio quality differences between a Sennheiser MD46 and Sennheiser G3 lav kit, as some readers/viewers had inquired about our audio gear during CES.
The IHS discussion is an interesting one, and we’ll soon be demonstrating the cooling differences between delidded and lidded CPUs. Until then, though, we’re talking strength and the reasoning for an IHS to begin with.
Video below, timestamps to follow:
The first and last of AMD’s Polaris GPUs hit the market last year, among them the RX 460 and subsequent Sapphire RX 460 Nitro 4GB, a card that underwhelmed us with unimpressive performance and an ambitious price. Just a few months later, overclocker der8auer implemented a BIOS flash to unlock additional stream processors on some RX 460 cards, bringing the count from 896 to 1024 by just flashing the card BIOS.
Preorders are now open for the iBUYPOWER “Snowblind” system we’ve been covering for the past few months, most recently at CES 2017. The most notable aspect of Project Snowblind is the modified NZXT Noctis 450 enclosure, which uses an LCD side panel in place of a traditional clear window.
To be clear: although the buzz surrounding Project Snowblind is generally about the side panel, Snowblind systems are complete prebuilt machines and their enclosures are not available separately at this time (see our Noctis 450 review for details on the non-LCD version). As such, there are three SKUs available for preorder: Snowblind, Snowblind Pro, and Snowblind Extreme, for $1500, $1800, and $2500 respectively, with monthly payment plans optional. Additional components can be added for additional cost, but only white or silver varieties are allowed in order to give the panel maximum contrast.
This is our first episode of Ask GN since returning from CES, responsible for producing about two weeks’ worth of content that we’ve only just finished publishing. For this episode, we’re addressing questions pertaining primarily to reflowing / reballing dead components (laptops & GPUs), OEM vs. non-OEM CPUs, and a couple of airflow topics related to liquid cooling. Other questions include clarification on Kaby Lake & Skylake compatibilities, and keyboard USB passthrough impact on latency.
For our regulars, the usual accompaniment to Ask GN articles is a preview on what’s to come for the week. This week, we’ve got several CPU content items planned, a PC build, and lots of behind-the-scenes testing that will be published next week.
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