Under guidelines by AMD that we could show Threadripper CPU installation and cooler installation, we figured it’d also be pertinent to show cooler coverage on TR and RAM clearance. These all fall under the “installation” bucket and normally wouldn’t get attention from us, but Threadripper’s uniquely sized socket with uniquely positioned dies demands more instruction.
Threadripper thermal compound & coldplate coverage has been a primary topic of discussion since we first showed motherboards at Computex. We’ve generally offered that, theoretically, coldplate coverage should be “fine” as long as the two Threadripper CPU dies are adequately covered by the coldplate. In order to determine once and for all whether Asetek coolers will cover the IHS appropriately, seeing as that’s what TR ships with, we mapped out the dies on one of our samples, then compared that to CLC thermal paste silk screens, coldplates, and applied thermal compound.
Fractal Design is responsible for the Fractal Define C, one of our top-preferred cases from the past year. The Define C is a stout, well-constructed enclosure with competitive acoustics damping (behind only the Pure Base 600, in our tests) and thought-out cable management. Now, at what feels to be the mid-point of an ongoing trend in the industry, Fractal has announced its introduction of the Fractal Define C TG and Fractal Define C Mini TG (the latter is a shrunken ITX version of the ATX Define C).
During press briefings leading to Vega’s gaming variant launch, which looks similar to the FE card (but with DSBR and power saving features now enabled), GamersNexus met with several members of AMD’s RTG team to discuss RX Vega’s future.
One such conversation with a group of media led to the topic of lacking CrossFire marketing materials in RX Vega’s slide decks, with parallels drawn to Polaris’ brandished claims from 2016. With the Polaris launch, great emphasis was placed on dual RX 480 cards evenly embattling GTX 1080 hardware – something we later found to be of mixed virtue. This time, it seems, none of the CrossFire claims were made; in fact, "CrossFire" wasn’t once mentioned during any of the day-long media briefing. It wasn’t until media round-table sessions later in the day that the topic of CrossFire came up.
The prices are $400 for the RX Vega 56, $500 for the RX Vega 64, and we think $600 for the liquid-cooled RX Vega 64 Aqua. AMD’s launching these with different bundles for their other products as well, but we’ll talk about that momentarily. Today, we’re providing details on the RX Vega specifications, pricing, and other preliminary information (like TDP/TGP) for the GPU. We’ll have a separate content piece coming out shortly that provides a deeper dive on the Vega GPU architecture.
The RX Vega 64 flagship launches at $500 for the reference card – and so likely the range is $500 to $600 for AIB partner models, which would include your standard Strix, Twin Frozr, Windforce, and other coolers. Liquid-cooled models will clock higher by way of reduced power leakage, as we previously showed, though air cooled models can also accomplish this to some lesser but non-trivial extent. AMD’s liquid-cooled model did not carry a standalone price, but had a bundle price of $700 for the card with various discounts for other parts. More on that later.
There’s no doubt that most the news circulating right now will pertain to AMD’s new driver update – and it’s an impressive update, one which we’ll discuss below, but we wanted to revive the “gaming” & “pro” mode discussion.
In speaking with AMD about its “Gaming” and “Pro” toggle switch in the Vega drivers – something we previously demonstrated to be a UI-only switch – we learned that the company intends to do something more meaningful going forward. As of now, the toggle is nothing more than a psychological switch, limiting its usefulness to removing the WattMan button from the UI – not all that useful, in other words. Functionally pointless for Vega: FE as it launched, and symptomatic of a driver package which was either woefully incomplete or intended to encourage a placebo effect.
GamersNexus today received word from a manufacturer (that asked to remain unnamed) that AMD’s Threadripper CPUs will include Asetek retention kits in the retail packaging for the product, though a cooler itself will not be included; at least, not in the initial launch of Threadripper products. From what we’ve seen of AMD’s unveiled box, it’s clear that no cooler is included, but the Asetek retention kit will permit all Asetek-made CLCs to mount Threadripper at launch. This would include popular products like the NZXT Kraken series, EVGA CLC series, and about half of Corsair’s coolers (the other half being CoolIT-made). The H100iV2 and H115i are included in the list of Asetek-made Corsair coolers, for clarity.
This week's hardware news recap covers rumors of Corsair's partial acquisition, HBM2 production ramping, Threadripper preparation, and a few other miscellaneous topics. Core industry topics largely revolve around cooler prep for Threadripper this week, though HBM2 increasing production output (via Samsung) is also a critical item of note. Both nVidia and AMD now deploy HBM2 in their products, and other devices are beginning to eye use cases for HBM2 more heavily.
The video is embedded below. As usual, the show notes rest below that.
Every now and then, a content piece falls to the wayside and is archived indefinitely -- or just lost under a mountain of other content. That’s what happened with our AMD Ryzen pre-launch interview with Sam Naffziger, AMD Corporate Fellow, and Michael Clark, Chief Architect of Zen. We interviewed the two leading Zen architects at the Ryzen press event in February, had been placed under embargo for releasing the interview, and then we simply had too many other content pieces to make a push for this one.
The interview discusses topics of uOp cache on Ryzen CPUs, power optimizations, shadow tags, and victim cache. Parts of the interview have been transcribed below, though you’ll have to check the video for discussion on L1 writeback vs. writethrough cache designs and AMD’s shadow tags.
Ask GN returns for its 54th episode – we’ve gotten more consistent than ever – to discuss Noctua fan manufacturing locations (China & Taiwan), thermal pads vs. thermal paste usage on MOSFETs, Vega 10-bit support, and a couple other items.
A few of the items from this week peer into GN’s behind-the-scenes workings, as several viewers and readers have been curious about our staff, whether we keep products, or why we “waste” GPUs by using them for things other than mining.
As always, timestamps below the embed.
This week's hardware news recap gives us a break from Vega -- if a brief one -- so that we can discussed nVidia's multi-chip GPU white paper, AMD's Ryzen Threadripper CPUs (1920X + 1950X), the R3 CPUs, and new fabs for Samsung. This discussion also bleeds over into DRAM shortages and NAND prices, particularly relating to Micron's fab "event" from last week.
The show notes are below the embedded video, for folks who prefer the notes and sources.
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