GamersNexus secured an early exclusive with the new Gigabyte Gaming 7 motherboard at CES 2018, equipped with what one could confidently assume is an AMD X470 chipset. Given information from AMD on launch timelines, it would also be reasonable to assume that the new motherboards can be expected for roughly April of this year, alongside AMD’s Ryzen CPU refresh. This is all information learned from AMD’s public data. As for the Gigabyte Gaming 7 motherboard, the first thing we noticed is that it has real heatsinks on the VRMs, and that it’s actually running what appears to be a higher-end configuration for what we would assume is the new Ryzen launch.

Starting with the heatsink, Gigabyte has taken pride in listening to media and community concerns about VRM heatsinks, and has now added an actual finstack atop its 10-phase Vcore VRM. To give an idea, we saw significant performance improvement on the EVGA X299 DARK motherboard with just the finned heatsinks, not even using the built-in fans. It’s upwards of 20 degrees Celsius improvement over the fat blocks, in some cases, since the blocks don’t provide any surface area.

This week's hardware news recap covers rumors of Corsair's partial acquisition, HBM2 production ramping, Threadripper preparation, and a few other miscellaneous topics. Core industry topics largely revolve around cooler prep for Threadripper this week, though HBM2 increasing production output (via Samsung) is also a critical item of note. Both nVidia and AMD now deploy HBM2 in their products, and other devices are beginning to eye use cases for HBM2 more heavily.

The video is embedded below. As usual, the show notes rest below that.

Corsair, NZXT, Thermaltake, and EVGA closed-loop liquid coolers presently have no official AM4 retention kit support, leaving the companies exposed to questions from customers waiting to build Ryzen systems. This delay has affected the most popular coolers presently on the market, to include the Corsair H100iV2, H115i, NZXT X62/52/42, and new EVGA CLCs, but hasn’t affected all CLCs available. Some SIs, for instance, have blown throw stock of CoolIT-supplied CLCs from Corsair (like the H110i and H60), but haven’t been able to fill orders of units that use a four-screw mounting mechanism.

We have details for you on when your brackets will be available and on what caused the delays to begin with. This content contains several official comments and statements from the affected cooling manufacturers.

Intel has enjoyed relatively unchallenged occupancy of the enthusiast CPU market for several years now. If you mark the FX-8350 as the last major play prior to subsequent refreshes (like the FX-8370), that marks the last major AMD CPU launch as 2012. Of course, later launches in the FX-9000 series and FX-8000 series updates have been made, but there has not been an architectural push since the Bulldozer/Piledriver/Steamroller series.

AMD Ryzen, then, has understandably generated an impregnable wall of excitement from the enthusiast community. This is AMD’s chance to recover a market it once dominated, back in the Athlon x64 days, and reestablish itself in a position that minimally targets parity in price to performance. That’s all AMD needs: Parity. Or close to it, anyway, while maintaining comparable pricing to Intel. With Intel’s stranglehold lasting as long as it has, builders are ready to support an alternative in the market. It’s nice to claim “best” on some charts, like AMD has done with Cinebench, but AMD doesn’t have to win: they have to tie. The momentum to shift is there.

Even RTG competitor nVidia will benefit from this upgrade cycle. That’s not something you hear a lot – nVidia wanting AMD to do well with a launch – but here, it makes sense. A dump of new systems into the ecosystem means everyone experiences revenue growth. People need to buy new GPUs, new cases, new coolers, and new RAM to accompany any moves to Ryzen. Misalignment of Vega and Ryzen make sense in the sense of not smothering one announcement with the other, but does mean that AMD is now rapidly moving toward Vega’s launch. Those R7 CPUs don’t necessarily fit best with an RX 480; it’s a fine card, just not something you stick with a $400-$500 CPU. Two major launches in short order, then, one of which potentially drives system refreshes.

AMD must feel the weight borne by Atlas at this moment.

In this ~11,000 word review of AMD’s Ryzen R7 1800X, we’ll look at FPS benchmarking, Premiere & Blender workloads, thermals and voltage, and logistical challenges. (Update: 1700 review here).

AMD’s Ryzen platform is on its march to the launch window – likely February of 2017 – and will be pushing non-stop information until its time of delivery. For today, we’re looking at the CPU and chipset architectures in greater depth, following-up on yesterday’s motherboard reveal.

First, let’s clear-up nomenclature confusion: “Zen” is still the AMD next generation CPU architecture name. “Ryzen” is the family of CPUs, comparable to Intel’s “Core” family in some loose ways. Each Ryzen CPU will exist on the Zen architecture, and each Ryzen CPU will have its own individual alphanumeric identifier (just like always).

CES 2017 allowed our team to dig deeper into the Zen architecture, its Ryzen family of CPUs, and the ensemble of AM4 motherboards in the pipes. There are currently “more than 50” SKUs of AM4 motherboards, according to the AMD team, and that’ll include the X370, B350, A320, and A/B/X300 chipsets. In this article, we’ll provide a GN-made block diagram of Ryzen’s PCIe lanes and other features, a look at ASRock and Biostar motherboards, and some brief notes on the S3.0 radiator.

For previous coverage of AM4 motherboards, check out our reporting on MSI’s XPOWER Titanium X370 and Gigabyte’s X370 / B350 gaming boards.

Before diving in, here’s a block diagram that GamersNexus created to better represent the Ryzen / Chipset relationship:

AMD’s CES 2017 meeting room was primarily stocked with untouchable demos: Ryzen populated about half the room, Vega took a small (but critical) corner, and HDR screens took the rest. Given the challenges of demonstrating HDR in any medium other than analog (read: human eyes), we’ll skip that for now and focus on some of the Ryzen information. If Vega interests you, check out our write-up on the basics.

AMD’s suite served as a home to motherboards from MSI, Gigabyte, ASRock, and Biostar. We already spent some time with the MSI motherboards, including a look at the VRM design for each of the two configurations on display, and will today be focusing on Gigabyte’s X370, B350, and A320 motherboards. The company didn’t have any X300 mini-ITX boards at AMD’s suite, unfortunately, but did have micro-ATX displayed alongside the usual ATX form factor motherboards.

Despite the general lack of official documentation on AM4, we were able to get hands-on with some early AM4 motherboards from MSI at CES 2017. This is the first time – from AMD or from others – that we’ve received any detail on the new AM4 products, and the first time they’ve been demonstrated in public. The company debuted its X370 XPOWER Titanium overclocking motherboard (For Ryzen) alongside a mid-range B350 Tomahawk board, neither yet adorned with a price. We do have a release date target, though.

During PAX Prime 2016, we posted some official documentation on lower-end AM4 chipsets that would ship to bulk buyers, for use in HP-like systems at Costco-like places. Since then, we’ve learned that the X370 platform will crown the AM4 chipset accompaniment, with B350 falling next under that, and A320 (already known, see: PAX) at the low-end. A320 would be comparable to A68, were we to draw parallels to previous generation platforms. From what MSI tells us, an X300 chipset will also exist, but is not responsible for lane assignment and I/O tasking in the same way that X370 and B350 are; instead, X300 will likely see exclusive use on SFF platforms, and will perform no substantial functions. This was also detailed in our PAX coverage.

AMD’s AM4 platform sees the convergence of FM and AM# platforms, known to carry Carrizo APUs and the future’s Zen CPUs. German site Planet3DNow spoke to motherboard manufacturers about scheduling for AM4 motherboard launches and learned that March, 2016 is the earliest targeted availability. The site goes on to conclude an ahead-of-schedule Zen launch, though we believe it is almost certainly the case that Carrizo/Excavator moves to desktop at this time, with Zen CPUs remaining targeted to EOY 2016.

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