Right after we said that an AMD R3 CPU is “enough for gaming,” stealing the old Intel mantra from many generations ago, Intel decided to launch its 10-series CPUs. Intel calls this “10th Gen,” but in reality, it’s the nth Gen of a long-standing architecture. We’ve lost count at this point, but either way, it’s the 10-series of processors. The i5-10600K is the one we’re reviewing here, and it’s actually repositioned to resurrect that old “an i5 is enough for gaming” phrasing from the days of the i5-4690K and i5-6600K. This, we think, is the more interesting CPU as compared to Intel’s i9-10900K that we reviewed in the previous video, but both have points of intrigue. The biggest one is core-to-core deltas in thermals now that Intel is sanding the die down, something we showed previously in our i9-10900K delid. Today, we’re reviewing the i5-10600K.

NOTE: THIS IS A DELAYED PUBLICATION OF OUR 10600K REVIEW FROM YouTube. If you already saw this on YouTube, it's the same thing, just the written format. We have not changed anything, so new information we've uncovered about the 10600K isn't included post-launch and you'll need to check our channel for follow-up coverage, like our in-depth tuning piece on the 10600K.

With the new influx of CPUs from AMD and Intel, and more rumored on the horizon, we wanted to round-up all of our recent testing into one concise piece for people looking for recommendations on the best CPU for different tasks. We’ve published several hours’ worth of content in the form of reviews, tuning, and follow-up coverage, so if you want the full details and depth for anything check those pieces. We’ll be focusing more on firm recommendations for each category in this video and less on the deeper details, with our categories including: Best gaming CPU, best budget gaming CPU, best small business or hobbyist production CPU, best workstation CPU, best overall, most fun to overclock, and most disappointing.

Another busy week of hardware news is in the books, and there’s a lot to talk about. Perhaps most notably, AMD has performed its 180 in regards to Zen 3 support on B4xx chipsets, enabling a one-way upgrade path for those wanting to migrate to Ryzen 4000 later this year. We have an exhaustive (pt1) video (pt2) series (pt3) dedicated to the topic and the current state of BIOSes, so we won’t delve into it here.

As ever, there’s more broad industry news, such as Microsoft admitting it was on the wrong side of the open-source explosion at the turn of the century, and TSMC pulling all chip orders from Huawei thanks to ever tightening US export restrictions. We have yet to see how this will affect Huawei, but it is almost certainly going to be detrimental to its business.

Within GN specifically, we’ve completely sold out of our GN wireframe mouse mats -- thanks for the support! More mouse mats are currently on back-order for the next production run. We expect those back-orders will ship in August. Meanwhile, we’ve posted our i9-10900K review and i5-10600K review, both of which look at frequency performance, overclocking, die sanding tests, and more. It also seems AMD has dropped the price on its Ryzen 9 3900X in response to Comet Lake-S. Additionally, if you happen to live near a MicroCenter, there’s an in-store promotion that will get you the Ryzen 9 3900X for $380.

Follow below for the video embed and article.

Intel’s continuing to bring the heat, literally and figuratively, and is now leveling its new 10C/20T part squarely at AMD. We have a separate in-depth review coming up on the 10600K, which has interesting implications for the R5 3600 and the realm of gaming, but for launch, we need to start with the flagship 10900K. That’s not the 10900X, mind you, but the 10900K, which is the part socketable for LGA1200 and Z490 motherboards. We’ll be looking at whether Intel’s die sanding worked for leveling-off thermals, benchmarking games, initial overclocking on the ASUS Max XII Extreme, production workloads versus the 3900X, and more.

UPDATE: Intel i5-10600K review is now live: https://www.youtube.com/watch?v=iQVBlCfb72M

It’s been another interesting week in the realm of hardware and technology. The week started off slowly, but ended with a deluge of interesting stories, mostly as it relates to US semiconductor manufacturing. In addition to Intel and Samsung in talks with the Department of Defense, it looks as if TSMC will be adding a second fab to its US roster.

We also have news on AMD’s open-source GPUOpen, and its apparently not so open-source  Radeon Rays solution. Sometimes. There’s also news on the recently unveiled Unreal Engine 5 and how Epic CEO Tim Sweeney feels about the SSD storage solutions in the PlayStation 5. 

Elsewhere at GN, we recently covered Nvidia’s GTC 2020 keynote where Ampere was formally announced -- check out both the article and video. We’ve also been extensively overclocking the Ryzen 3 3100, as well as the AMD Ryzen 3 3100 Infinity Fabric clock (FCLK). 

Before beginning this week's hardware news recap, we'd like to highlight for our readers -- or those who just prefer referencing our articles rather than scrubbing through videos at a later date -- that we've been making a bigger push to publish written content to the site lately. This site serves almost more as an archive for the scripts than anything else these days, just because the nature of maintaining it is very difficult given our current working hours, but we like it and we know that all of you like the written format. We've made an active effort in increasing how many of our videos (from YouTube) end up on the website in written form, so we published the AMD Ryzen 3 3100 review, Ryzen 3 3300X review, and our B550 vs. X570 (et al) chipset comparison. Check them out on the home page.

In the meantime, we've got a lot of hardware news for the week to recap: The FCC is being forced to reveal its server logs for concerns stemming from fake comments about net neutrality, NVIDIA and AMD are vying over 5nm supply from fab TSMC, RTX Ampere is getting an announcement this week, Intel Alder Lake and LGA1700 are in the rumor mill, and more.

In this content, we’re going to be breaking-down the AMD B550 vs. X570, B450, X470, X370, and A320 chipset specifications number-by-number. Our goal is to look at this purely from a facts-based angle of what the differences are, and those differences will include both numerical specification differences (number and type of lanes afforded) and forward or backwards compatibility differences. This includes the intent of the 500-series chipsets to support Zen 3 architecture (reminder: that’s not the same as Ryzen 4000 mobile, nor is it the same as Ryzen 3000 desktop), while the existing B450 and X470 boards are left to cap-out at Ryzen 3000 series (Zen 2) parts.

We have some additional discussion of the basics of naming, including CPU naming distinctions, in our video component that accompanies this article. You may get more information on the differences between AMD Zen generations and Ryzen generations in that content.

This is the big one: In this review, we’re benchmarking the AMD R3 3300X $120 CPU, but we’re specifically interested in the real-world impact of the CCX-to-CCX communication latency in the Ryzen 3 3100 versus the Ryzen 3 3300X at the same overclocked frequency of 4.4GHz. It’s massive in some instances, beyond 20%, and eliminates the ability to just overclock the otherwise identical 3100 to meet the 3300X performance for cheaper. As discussed in our Ryzen 3 3100 review that’s already live, the 3300X runs a 4+0 core configuration with everything on one CCD, on one CCX, while the 3100 runs a 2+2 configuration on two CCXs on that CCD. We’re going to look at how much that impacts performance, but also review the 3300X versus basically every other current CPU, and a few older ones.

Today we’re reviewing the AMD R3 3100 and Ryzen 3 3300X, but we have a dedicated content piece for the AMD R3 3300X because we added benchmarks for the two CPUs at the same frequency, exposing the latency difference between them. For this specific article and video, we’re focusing all of our attention on the AMD R3 3100 CPU at $100, potentially a high-volume part for budget PC builds. That includes overclocking, power consumption, gaming benchmarks, frequency analysis, production workloads (Premiere, Photoshop, compile, et al.), and more. Our AMD Ryzen 3 3300X review will post within a couple of hours on this one (on YouTube, at least, if not also on the site), and that’ll feature head-to-head 4.4GHz overclocks on the R3 3100 vs. R3 3300X, where the 3300X’s 4+0 core CCX configuration can be tested for its real-world latency impact versus the 2+2 3100. 

Writing this review, it felt like we were writing a review script from the same era as the 7700K, and not just because AMD is positioning itself against the 2017 CPU. Back when we reviewed the 7700K, all the comparisons were to the 6700K, the 4790K, the 2600K – the theme was that it was all intra-brand competition. The same is happening now, where we’re throwing a few Intel names out there as comparisons, but until the 10-series, AMD really is just competing against itself. It’s fascinating in a way, because from a reviewer and editorial standpoint, it really does feel like dejavu – except it’s a different company in 2020. The new AMD Ryzen 3 3100 and 3300X CPUs have a release date set for May 21, 2020, with the Intel 10th “Gen” release date set for May 20, 2020.

Hardware news this week is slammed with announcements to cover. NVIDIA, Intel, and AMD all had big announcements -- for once, all official and not rumors -- and that includes a big focus on upcoming GPUs. AMD reconfirmed its commitment to RDNA2 in 2020, despite global economic and manufacturing challenges. NVIDIA, meanwhile, invites everyone to "get amped" for its upcoming GTC Online event, a clear indicator of Ampere GPUs. Intel teased its Xe GPUs in an interesting packaging, something worth covering to the extent we currently can.

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