Our Computex 2018 coverage continued as we visited the BeQuiet! booth. This year, Be Quiet! announced the new Dark Rock Pro for socket TR4 (Threadripper), timely for Threadripper 2, and also showed a trio of refreshed cases -- the Silent Base 801, 601, and Dark Base 900 Rev 2.0.
The Dark Rock Pro TR4 is specifically designed with AMD’s Threadripper socket TR4 in mind. The Dark Rock Pro’s only real difference from previous iterations is the new full coverage block for Threadripper. The new cold plate is designed to help ensure full die coverage on Threadripper, which we discussed back in August of last year. We’ve previously found there to be a measurable difference when using TR4 full coverage coolers vs. non-TR4 ones. Price and release date were not available at this time.
With B350, B360, Z370, Z390, X370, and Z490, we think it’s time to revisit an old topic answering what a chipset is. This is primarily to establish a point of why we need clarity on what each of these provides – there are a lot of chipsets with similar names, different socket types, and similar features. We’re here to define a chipset today in TLDR fashion, with a later piece to explain the actual chipset differences.
As for what a chipset actually is, this calls back to a GN article from 2012 – though we can do a better job now. The modern chipset is a glorified I/O controller, and can be thought of as the spinal cord of the computer, while the CPU is the disembodied brain. Intel calls its chipset a PCH, or Platform Controller Hub, while AMD just goes with the generic and appropriate term “chipset.” The chipset is the center of I/O for the rest of the motherboard, assigning I/O lanes to devices like SATA, gigabit ethernet, and USB ports.
Intel’s Pentium G line has largely managed to hold-on as one of the better buys of the past few years. There was a brief period where the G3258 made a lot of sense for ultra budget-minded buyers, then the G4560 recently – particularly at the actually good price of $60 – and now Intel has its Pentium G 5000 series. The G4560 had stunted growth from limited stock and steep hikes on MSRP, forcing people to consider i3s instead, up until R3s shipped. The 4560 remained a good buy as it dropped towards $60, fully capable of gaming on the cheap, but it is now being replaced by the units we’re reviewing this month.
We’re starting with the Intel Pentium G5600, which is the most expensive of the new Pentium Gold line. At $95, it’s about $40 more than the G4560, $10 more than the G5500, and $20 more than the G5400. The R3 1300X is about $105, and the R3 1200 is about $95.
DDR5 may achieve mass switch-over adoption by 2022, based on new estimates out of memory makers. A new Micron demonstration had DDR5 memory functional, operating on a Cadence IMC and custom chip, with 4400MHz and CL42 timings. It's a start. Micron hopes to tighten timings over time, and aims to increase frequency toward 6400MHz as DDR5 matures. It's more of a capacity solution, too, with targeted densities at 16Gb and 32Gb for the future.
In addition to the week's DDR5 news, detailed in more depth below, we also have roadmap leaks from AMD and Intel that indicate Z490 and Z390 chipsets shipping this year. We're not yet sure what Z490's purpose is, but we know that it's an AMD product -- and the first of the new chipsets to take a Z prefix, just like Intel's performance series.
Our show notes below cover all the stories, or just check the video:
In case you find it boring to watch an IHS get sanded for ten minutes, we’ve written-up this recap of our newest video. The content features a lapped AMD Ryzen APU IHS for the R3 2200G, which we previously delidded and later topped with a custom copper Rockit Cool IHS. For this next thermal benchmark, we sanded down the AMD Ryzen APU IHS with 600 grit, 1200 grit, 1500 grit, 2000 grit, and then 3000 grit (wet) to smooth-out the IHS surface. After this, we used a polishing rag and compound to further buff the IHS (not shown in the video, because it is exceptionally boring to watch), then we cleaned it and ran the new heatspreader through our standardized thermal benchmark.
We wrote a couple of scripts to scrape the data shown in this content, showing memory price trends for the year so far. We recently set forth on an information gathering mission to learn about how much it costs to actually buy different types of memory, allowing us to look at just how much the memory suppliers are making. They’re raking in record profits with record stock highs – just look at the below Hynix or Micron stock chart: Despite claimed cleanroom limitations, the companies are making record revenue. Today, we’re talking about why and how the memory industry is in the shape it’s in.
This is Part 2 of our RAM Report series. The first part aired previously, and dug deep into five years of memory price data and earnings results for memory suppliers. Be sure to read or watch that content if you haven’t already.
The headlining story for the past week covers the memory supplier class action that was recently filed (vs. SK Hynix, Samsung, and Micron), alleging conspiracy to fix prices. In contension for the headline story, Intel's 10nm process problems have grown more complicated, seemingly preempting the company's hiring of Jim Keller, former AMD Zen architect.
Some controversy bubbled-up recently when reddit, as it does, found its newest offense at which it could express collective rage. That offense was AMD’s CPU warranty, which had previously indicated that any cooler aside from included stock coolers would violate the warranty – not that they’d be able to prove it, if we’re being honest.
We reached-out to AMD for comment when this story went public, and received a response today that AMD had updated its warranty terms for clarity. The original language was meant to prevent warranty replacements for scenarios where the CPU had been damaged by an out-of-spec cooler (think: something like an LN2 pot, or the jury-rigging we do at GN). It was not meant to block warranty replacements for issues unrelated to coolers.
For our 2700/2700X review, we wanted to see how Ryzen 2’s volt-frequency performance compared to Ryzen 1. We took our Ryzen 7 2700X and an R7 1700 and clocked them both to 4GHz, and then found the lowest possible voltage that would allow them to survive stress tests in Blender and Prime95. Full results are included in that review, but the most important point was this: the 1700 needed at least 1.425v to maintain stability, while the 2700X required only 1.162v (value reported by HWiNFO, not what was set in BIOS).
This drew our attention, because we already knew that our 2700X could barely manage 4.2GHz at >1.425v. In other words, a 5% increase in frequency from 4 to 4.2GHz required a 22.6% increase in reported voltage.
Frequency in Ryzen 2 has started to behave like GPU Boost 3.0, where temperature, power consumption, and voltage heavily impact boosting behavior when left unmanaged. Our initial experience with Ryzen 2 led us to believe that a volt-frequency curve would look almost exponential, like the one on the screen now. That was our hypothesis. To be clear, we can push frequency higher with reference clock increases to 102 or 103MHz and can then sustain 4.2GHz at lower voltages, or even 4.25GHz and up, but that’s not our goal. Our goal is to plot a volt-frequency curve with just multiplier and voltage modifications. We typically run out of thermal headroom before we run out of safe voltage headroom, but if voltage increases exponentially, that will quickly become a problem.
There’s a new trend in the industry: Heatsinks. Hopefully, anyway.
Gigabyte has listened to our never-ending complaints about VRM heatsinks and VRM thermals, and outfitted their X470 Gaming 7 motherboard with a full, proper fin stack and heatpipe. We’re happy to see it, and we hope that this trend continues, but it’s also not entirely necessary on this board. That doesn’t make us less excited to see an actual heatsink on a motherboard; however, we believe it does potentially point toward a future in higher core-count Ryzen CPUs. This is something that Buildzoid speculated in our recent Gaming 7 X470 VRM & PCB analysis. The amount of “overkill” power delivery capabilities on high-end X470 boards would suggest plans to support higher power consumption components from AMD.
Take the Gigabyte Gaming 7: It’s a 10+2-phase VRM, with the VCore VRM using IR3553s for 40A power stages. That alone is enough to run passive, but a heatsink drags temperature so far below requirements of operating spec that there’s room to spare. Cooler is always better in this instance (insofar as ambient cooling, anyway), so we can’t complain, but we can speculate about why it’s been done this way. ASUS’ Crosshair VII Hero has the same VRM, but with 60A power stages. That board, like Gigabyte’s, could run with no heatsink and be fine.
We tested with thermocouples placed on one top-side MOSFET, located adjacent to the SOC VRM MOSFETs (1.2V SOC), and one left-side MOSFET that’s centrally positioned. Our testing included stock and overclocked testing (4.2GHz/1.41VCore at Extreme LLC), then further tested with the heatsink removed entirely. By design, this test had no active airflow over the VRM components. Ambient was controlled during the test and was logged every second.
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