Overclocking engineer "Der8auer" has come out with his newest product: The Skylake-X Direct Die Frame cooling bracket. The bracket is intended to replace the ILM (independent loading mechanism) on the motherboard, used to act as a shim between a delidded CPU and a cooler. The goal is to not only delid the CPU and replace the compound, but also completely eliminate the heatspreader. Traditionally, the IHS would be kept post-delid, just with better compound and with removal of the silicone adhesive. In this application, you would delid the CPU, refresh the compound, remove the adhesive, and leave the IHS off, then mount it in the Skylake-X direct die bracket.

Some of our recent delid-focused content, "What We've Learned Delidding Intel CPUs," has highlighted that a light silicone adhesive seal vs. no seal vs. heavy seal can have significant impact on cooling. Heavy seals, for instance, can easily result in worse performance than stock -- even with liquid metal. We recommend not resealing the IHS at all and just allowing the cooler to retain the IHS, but a seal is sometimes needed. Shipping is a good example of this.

Just a quick update for everyone: We've got a major feature -- an end-of-year special that includes a short film (something we've never done before) -- going up tomorrow at around 9AM EST. That'll be sort of an end-of-year recap of a few key components, primarily those that disappointed us.

In the meantime, while we were playing one-day roles of directors and cinematographers, we've set to work on delidding another 7980XE. This will be our third delid of the 18C CPU, with another ~4~5 delids of lower-end CPUs from the past few months. Our previous delid was for Kyle of "Bitwit," which later led to our Intel X299 VRM thermal investigation of the ASUS Rampage VI Extreme motherboard's VRM temperatures. It was an excellent opportunity for us to explore potential sideshoot content pieces in more depth, and gave us multiple samples to build a larger sample size.

We're now up to 3x 18C CPUs delidded, and are collecting data on the latest for Ed from Tech Source. The delid just completed, and we're now in the resealing stage.

Running through the entire Skylake X lineup with TIM vs. liquid metal benchmarking means we’ve picked-up some very product-specific experience. Skylake X has a unique substrate composition wherein the upper substrate houses the silicon and some SMDs, with the lower substrate hosting the pads and some traces. This makes delidding unique as well, made easier with Der8auer’s Delide DieMate X (available in the US soon). This tutorial shows how to delid Intel Skylake X CPUs using the DieMate X, then how to apply liquid metal. We won't be covering re-sealing today.

Still, given the $1000-$2000 cost with these CPUs, an error is an expensive one. We’ve put together a tutorial on the delid and liquid metal application process.

Disclaimer: This is done entirely at your own risk. You assume all responsibility for any damage done to CPUs. We will do our best to detail this process so that you can safely follow our steps, and following carefully will minimize risk. Ultimately, the risk exists primarily in (1) applying too much force or failing to level the CPU, both easily solved, or (2) applying liquid metal in a way that shorts components.

There are many reasons that Intel may have opted for TIM with their CPUs, and given that the company hasn’t offered a statement of substance, we really have no exact idea of why different materials are selected. Using TIM could be a matter of cost – as seems to be the default assumption – and spend, it could be an undisclosed engineering challenge to do with yields (with solder), it could be for government or legal grants pertaining to environmental conscientiousness, or related to conflict-free advertisements, or any number of other things. We don’t know. What we do know, and what we can test, is the efficacy of the TIM as opposed to alternatives. Intel’s statement pertaining to usage of TIM on HEDT (or any) CPUs effectively paraphrases as “as this relates to manufacturing process, we do not discuss it.” Intel sees this as a proprietary process, and so the subject matter is sensitive to share.

With an i7-7700K, TIM is perhaps more defensible – it’s certainly cheaper, and that’s a cheaper part. Once we start looking at the 7900X and other CPUs of a similar class, the ability to argue in favor of Dow Corning’s TIM weakens. To the credit of both Intel and Dow Corning, the TIM selected is highly durable to thermal cycling – it’ll last a long time, won’t need replacement, and shouldn’t exhibit any serious cracking or aging issues in any meaningful amount of time. The usable life of the platform will expire prior to the CPU’s operability, in essence.

But that doesn’t mean there aren’t better solutions. Intel has used solder before – there’s precedent for it – and certainly there exist thermal solutions with greater transfer capabilities than what’s used on most of Intel’s CPUs.

While traveling, the major story that unfolded – and then folded – pertained to the alleged unlocking of Vega 56 shaders, permitting the cards to turn into a “Vega 58” or “Vega 57,” depending. This ultimately was due to a GPU-Z reporting bug, and users claiming increases in performance hadn’t normalized for the clock change or higher power budget. Still, the BIOS flash will modify the DPM tables to adjust for higher clocks and permit greater HBM2 voltage to the memory. Of these changes, the latter is the only real, relevant change – clocks can be manually increased on V56, and the core voltage remains the same after a flash. Powerplay tables can be used to bypass BIOS power limits on V56, though a flash to V64 BIOS permits higher power budget.

Even with all this, it’s still impossible (presently) to flash a modified, custom BIOS onto Vega. We tried this upon review of Vega 56, finding that the card was locked-down to prevent modding. This uses an on-die security coprocessor, relegating our efforts to powerplay tables. Those powerplay tables did ultimately prove successful, as we recently published.

Der8auer just delidded his high core-count Skylake-X CPU (12C to 18C), using the same kit that we used in our i9-7900X delidding video from Computex. Der8auer’s findings reveal a larger die than the 10C 7900X that we previously delidded, though the 12-18C units are ultimately using a die with disabled cores from the higher-end Xeon line. The delid also teaches us, critically, that even the 7920X CPUs are still not soldered. This isn’t necessarily a surprise, seeing as Intel’s operation has avoided soldering for the other recent CPUs, but we’re hoping that future Intel product lines move back to solder. Der8auer hasn't posted his findings of the 18C parts yet, so there is still room for a change -- but solder is looking unlikely.

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