We’ve been writing about the latest memory and Flash price increases for a bit now – and this does seem to happen every few years – but relief remains distant. The memory supply is limited for a few reasons right now, including new R&D processes by the big suppliers (Samsung, Toshiba, SK Hynix, Micron) as some of the suppliers attempt to move toward new process technology. More immediately and critical, the phone industry’s launch cycle is on the horizon, and that means drastically increased memory sales to phone vendors. Supply is finite – it has to come out of inventory somewhere, and that tends to be components. As enthusiasts, that’s where we see the increased prices come into play.
This was largely no surprise, given the stance that both the current administration and the newly appointed head of the FCC have adopted. The reversal of the rules traveled quick enough through the House and Senate that constituents had little chance to mitigate the overturn. We’ve covered this issue since it became public news, but in the event you’re not up to date, the now non-existent rules would have required ISPs to obtain clear consent before using data for advertising and other monetary purposes.
Kingston Digital was responsible for a full 16% of SSDs shipped in 2016, according to data compiled by research firm Forward Insights. This puts their market share in second place, just behind Samsung’s 21%.
Senate Republicans have voted to rescind momentous laws protecting Internet privacy that the FCC wrote and adopted last year. U.S. senators voted 50 to 48 to approve a joint resolution sponsored by Sen. Jeff Flake (R-Ariz) that would prevent that privacy framework from going into effect. What’s more, the resolution seeks to bar the FCC from enacting similar laws. As of March 23rd, 2017, the resolution has passed the senate and moves toward the House where, barring a complete backlash, it will likely pass.
The Federal Communications Commission’s new rules were adopted last year to prevent ISPs from exploiting users’ behavioral data in contentious ways, such as selling it to paying third parties or creating targeted advertising. ISPs are no longer interested in just being network providers; they seek to monetize the consumer’s routine use of the internet to create their own digital economy—and they seek to do it without explicit consent. The previous FCC leadership viewed this as an overreach, thus the new privacy rules were set to go in effect. The rules primarily ensured the following:
Corsair, NZXT, Thermaltake, and EVGA closed-loop liquid coolers presently have no official AM4 retention kit support, leaving the companies exposed to questions from customers waiting to build Ryzen systems. This delay has affected the most popular coolers presently on the market, to include the Corsair H100iV2, H115i, NZXT X62/52/42, and new EVGA CLCs, but hasn’t affected all CLCs available. Some SIs, for instance, have blown throw stock of CoolIT-supplied CLCs from Corsair (like the H110i and H60), but haven’t been able to fill orders of units that use a four-screw mounting mechanism.
We have details for you on when your brackets will be available and on what caused the delays to begin with. This content contains several official comments and statements from the affected cooling manufacturers.
Between its visit to the White House and Intel’s annual Investor Day, we’ve collected a fair bit of news regarding Intel’s future.
Beginning with the former, Intel CEO Brian Krzanich elected to use the White House Oval Office as the backdrop for announcing Intel’s plans to bring Fab 42 online, with the intention of preparing the Fab for 7nm production. Based in Chandler, Arizona, Fab 42 was originally built between 2011 and 2013, but Intel shelved plans to finalize the fab in 2014. The rebirth of the Arizona-based factory will expectably facilitate up to 10,000 jobs and completion is projected in 3-4 years. Additionally, Intel is prepared to invest as much as $7 billion to up-fit the fab for their 7nm manufacturing process, although little is known about said process.
At the tail-end of a one-day trip across the country, this episode of Ask GN tides us over until our weekend burst of further content production. We’re currently working on turning around a few case reviews, some game benchmarks, and implementing new thermal calibrators and high-end equipment.
In the meantime, this episode addresses questions involving “doubled” DRAM prices, delidding plans for the i7-7700K, contact between a heatsink and the back of a video card, and a few other topics. Check back posthaste as we’ll ramp into publication of our i5-7600K review within the next day.
Video below, timestamps below that:
As predicted, DRAM-dependent components continue to grow more expensive as demand outpaces supply. Nanya Technology president Pei-Ing Lee confirmed that their DRAM’s average price will increase in the first and second quarter of 2017.
When we published our “Why Are RAM Prices So High” article in 2014, DRAM was transitioning to 25nm wafers—and now it’s transitioning again, this time to 20nm. Prices in the second half of 2017 are expected to stabilize, but depend largely on how quickly manufacturers gear up for the move to smaller dies—Nanya Technology will be simultaneously increasing 20nm production while cutting down on 30nm going into 2018.
SK Hynix has been busy as of late. We most recently covered their plans for expansion, which offered a cursory foretaste into what 2017 might hold for the semiconductor supplier. SK Hynix has also recently further delineated plans for 2017, trailing behind their still-fresh announcement of the industry’s first 8GB LPDDR4X-4266 DRAM packages aimed at next-generation mobile devices.
In revealing plans, SK Hynix intends to volumize production of new types of memory—not altogether unexpected. Their primary focus on NAND production and expansion over DRAM is most noteworthy, at least for impermanent future. As such, SK Hynix intends to start volume production of 72-layer 3D TLC NAND (3D-V4). For reference, SK Hynix’s 36-layer and 48-layer NAND were 3D-V2 and 3D-V3, respectively. Notable about SK Hynix’s fourth version of 3D NAND is that it will use block sizes of 13.5 MB over the 9 MB sizes of the second and third generation predecessors. Furthermore, SK Hynix intends to roll-out 256 Gb 3D TLC ICs by Q2 2017, with 512 Gb 3D TLC ICs coming in Q4 2017. SK Hynix’s new 72-layer 3D NAND should allow for higher capacity SSDs in smaller form factors and increase performance on a per IC basis.
As solid-state storage continues to displace mechanical drives, so too does the constriction of the HDD market continue. As part of their ongoing plan to stay profitable and financially stable, Seagate has opted to shut down its HDD manufacturing facility in Suzhou, China. The Suzhou plant was one of Seagate’s largest production assets, and its resultant closure will acutely reduce the company’s HDD output.
However, this isn’t unforeseen, as last year Seagate announced its intentions to augment manufacturing capacities from around 55-60 million drives per quarter to approximately 35-40 million drives per quarter in accordance with their continued restructuring initiative. As part of that effort, Seagate reduced global employee headcount by 8,000 last year. Moreover, the closing of the Suzhou facility will see the layoff of a further ~2,200 employees.
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