This week’s hardware news recap primarily focuses on Intel’s Minix implementation, alongside creator Andrew Tanenbaum’s thoughts on the unknown adoption of the OS, along with some new information on the AMD + Intel multi-chip module (MCM) that’s coming to market. Supporting news items for the week include some GN-style commentary of a new “gaming” chair with case fans in it, updates on nVidia quarterly earnings, Corsair’s new “fastest” memory, and EK’s 560mm radiators.
Find the show notes after the embedded video.
The Intel/AMD news just won’t stop this week. Raja Koduri has indeed left AMD—and he has indeed joined Intel. This was a fair bit of conjecture until now (we even mentioned it in our most recent HW News video, not knowing whether it would be confirmed or debunked), but Intel has released an official statement confirming the move, and the existence of their newly formed Core and Visual Computing Group, which Koduri will helm.
Raja Koduri is a prominent figurehead in the industry, especially as it relates to graphics, visuals, and GPU computing. He notably led AMD’s Radeon Technologies Group, and served as director of graphics for Apple. News of his move to Intel came during his sabbatical he announced back in September, under which he intended to spend time with his family after a grueling Vega launch. His experience and expertise will doubtless be invaluable as part of Intel’s strategy to aggressively expand their presence in the GPU market.
At long last, Intel and AMD have announced a partnership to build a new mobile chip. In broad terms, Intel will ship processors with integrated AMD Radeon graphics and HMB2--all on one package.
Intel and AMD have seemingly set their gaze on the current crop of gaming/production laptops and devices, which are far behind the trend of thinner, more power efficient devices with smaller footprints. PC enthusiasts on a mobile platform who want gaming performance and the power for content creation obviously don’t want to sacrifice function for form, so therein lies the rub--this is exactly the crux that Intel and AMD aim to address with this collaboration.
Since our delid collaboration with Bitwit, we’ve been considering expanding VRM temperature testing on the ASUS Rampage VI Extreme to determine at what point the VRM needs direct cooling. This expanded into determining when it’s even reasonable to expect the stock heatsink to be capable of handling the 7980XE’s overclocked heat load: We are seeking to find at what point we tip into territory of being too power-hungry to reasonably operate without a fan directly over the heatsink.
This VRM thermal benchmark specifically looks at the ASUS Rampage VI Extreme motherboard, which uses one of the better X299 heatsinks for its IR3555 60A power stages. The IR3555 has an internal temperature sensor, which ASUS taps into for a safety throttle in EFI. As we understand it, the stock configuration sets a VRM throttle temperature of 120C – we believe this is internal temperature, though the diode could also be placed between the FETs, in which case the internal temperatures would be higher.
Coffee Lake returns to the bench for its third review, with benchmarks now focusing on the Intel i3-8350K unlocked 4C/4T CPU. The 8350K (on Amazon here) essentially usurps the market of the previous i5-7600K, but is potentially squelched by CFL brethren i5-8400 CPUs, planting the 8350K in the same price/performance positioning as the 7350K in January.
The 7350K was a good idea, but the wrong launch price. Pricing later fell by ~$30 and made more sense, but the initial ~$180 retail availability was far too high to be worthwhile. Now, with the gap between an i5 and an i3 emphasized with 6C i5 CPUs, those differences become more noteworthy. The i5-8400, ignoring the absence of sensible partner boards, is priced at around the same target as the 8350K (+/-$10). Again, assuming you can find any – and assuming retailers can stick to one price. The R5 CPUs are also more appropriate comparisons against the i3-8350K, despite the i3/R3 naming equivalence. In terms of price, the R3s target a completely different market, and are not an appropriate price-to-price comparison for the 8350K.
As a reminder before getting started, we deployed a new testing methodology with Coffee Lake (our 8700K review), and have not yet fully re-populated our CPU charts.
Tripping VRM overtemperature isn’t something we do too often, but it happened when working on Bitwit Kyle’s 7980XE. We’re working on a “collab” with Kyle, as the cool kids call it, and delidded an i9-7980XE for Kyle’s upcoming $10,000 PC build. The delidded CPU underwent myriad thermal and power tests, including similar testing to our previous i9-7980XE delid & 7900X “thermal issues” content pieces. We also benchmarked sealant vs. no sealant (silicone adhesive vs. nothing), as all of our previous tests have been conducted without resealing the delidded CPUs – we just rest the IHS atop the CPU, then clamp it under the socket. For Kyle’s CPU, we’re going to be shipping it across the States, so that means it needs to not leak liquid metal everywhere. Part of this is resolved with nail polish on the SMDs, but the sealant – supposing no major thermal detriment – should also help.
Tripping overtemperature is probably the most unexpected side of our journey on this project. We figured we’d publish some data to demonstrate an overtemperature trip, and what happens when the VRMs exceed safe thermals, but the CPU is technically still under TjMax.
Let’s start with the VRM stuff first: This is a complete sideshoot discussion. We might expand it into a separate content piece with more testing, but we wanted to talk through some of the basics first. This is primarily observational data, at this point, though it was logged.
Along with the announcement of the nVidia GTX 1070 Ti, AMD officially announced its Raven Ridge and Ryzen Mobile products, shortly after a revenue-positive quarterly earnings report. This week has been a busy one for hardware news, as these announcements were accompanied by news of the PCIe 4.0 specification v1.0 document finalization, as PCI-SIG now ramps the PCIe 5.0 spec into design.
Show notes are listed below, with the video here:
Our Destiny 2 GPU benchmark highlighted massive performance uplift vs. beta on some devices, upwards of 50% on Vega, but was conducted in largely GPU-constrained scenarios. For this content piece, we’ll be exploring the opposite: CPU-constrained scenarios to benchmark Destiny 2 performance on AMD Ryzen and Intel Kaby/Coffee Lake parts, including the R7 1700, R5 1600X, R3 1200, and i7-7700K, i5-7600K, i3-8350K, and G4560.
Most of our test notes have already been recapped in the GPU benchmark, and won’t be fully repeated. Again, we ran a wide spread of tests during the beta, which will be informing our analysis for the Destiny 2 launch benchmarks. Find the previous content below:
Hardware news for the last week includes discussion on an inadvertent NZXT H700i case unveil (with “machine learning,” apparently), Ryzen/Vega APU, Vega partner card availability, and Coffee Lake availability.
Minor news items include the AMD AGESA 22.214.171.124 update to support Raven Ridge & Pinnacle Ridge, Noctua’s Chromax fans, and some VR news – like Oculus dropping its prices – and the Pimax 8K VR configuration.
Find the video and show notes below:
The Intel i5-8400 review got delayed from initial publication when we figured it’d be worth adding 2666MHz gaming tests. 3200MHz is our standard DDR4 memory speed, providing a solid baseline across Intel and AMD CPUs, but makes less sense for lower-end CPUs with questionable memory speed support. “Questionable” is used here because, as of now, we are not sure whether B/H boards will support only the native memory speed of 2666MHz or higher multipliers. Some board vendors have suggested a possibility of unlocked memory multipliers of 32/36x, but haven’t confirmed, while other sources have suggested a maximum speed of 2666MHz. Because we cannot reasonably confirm either, we decided to just test both, then let the chips fall where they may in 1Q18. That’s the launch period for the B/H boards, as we understand it, and means that the i5-8400 will make much more sense in 1Q18 than now.
As it stands now, the i5-8400 launch seems confused: The only pairing options are Z370 motherboards, which – although cheap ones exist – just don’t make a whole lot of sense for a locked CPU. It’s extra money spent where there need not be extra spend, leaving for a CPU ecosystem that becomes muddied and mismatched. That doesn’t mean the CPU is bad, of course, but it does mean that real-world motherboard pairings of the CPU will likely be far more reasonably priced in a few months.
As has always been the case, including in the i7-8700K review, we are testing with MCE disabled. Our follow-up MCE coverage was not because we had originally tested with it enabled, but because we wanted to demonstrate the performance differences. Anyone capable of reading that piece in its entirety should be aware of that, as the two boards were averaged, though clearly literacy is not always the case – so we’re reiterating it here. MCE off. Plain and simple, as it always has been. We are still using the Ultra Gaming Z370 board.
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