Der8auer just delidded his high core-count Skylake-X CPU (12C to 18C), using the same kit that we used in our i9-7900X delidding video from Computex. Der8auer’s findings reveal a larger die than the 10C 7900X that we previously delidded, though the 12-18C units are ultimately using a die with disabled cores from the higher-end Xeon line. The delid also teaches us, critically, that even the 7920X CPUs are still not soldered. This isn’t necessarily a surprise, seeing as Intel’s operation has avoided soldering for the other recent CPUs, but we’re hoping that future Intel product lines move back to solder. Der8auer hasn't posted his findings of the 18C parts yet, so there is still room for a change -- but solder is looking unlikely.
We asked Intel why Kaby Lake-X exists at its recent press day, challenging that the refreshed 7700 & 7600 CPUs can’t be used on LGA1151 sockets, that they aren’t significantly different from the predecessors, and that LGA2066 boards are way more expensive. The socket and chipset alone have a higher BOM cost for manufacturers than 200-series boards, and that cost is passed on to consumers. That’s not free. The consumer also pays for the components that won’t go unused, like the trace routing for half of the DIMMs (and the physical slots).
But Intel gave us an answer to that query.
Intel’s past few weeks have seen the company enduring the ire of a large portion of the tech community, perhaps undeservedly in some instances -- certainly deservedly in others. We criticized the company for its initial marketing of the 7900X – but then, we criticize nearly everyone for marketing claims that borderline on silly. “Extreme Mega-Tasking,” for instance, was Intel’s new invention.
But it’d be folly to assume that Skylake-X won’t perform. It’s just a matter of how Intel positions itself with pricing, particularly considering the imminent arrival of Threadripper. Skylake-X is built on known and documented architecture and is accompanied by the usual platform roll-out, with some anomalies in the form of Kaby Lake X's accompaniment on that same platform.
Today, we're reviewing the Intel Core i9-7900X Skylake X CPU, benchmarking it in game streaming (Twitch, YouTube) vs. Ryzen, in Blender & Premiere rendering, VR gaming, and standard gaming.
Intel seemingly moved its KBL-X and SKY-X CPU launches up, with the spotlight pointed at nine new enthusiast-class CPUs. A few of these are more similar to refreshes than others, but we also see the introduction of the i9 line of Intel CPUs, scaling up to 18C and 36T on the i9-7980XE CPU. We’ll go over prices and specs in this Computex news item, and note that we’ve already got motherboard coverage online for EVGA’s new X99 motherboards.
Starting with the marketing, then.
Following our in-depth first-look coverage of the EVGA GTX 1080 Ti Kingpin card, we now turn to the company’s upcoming motherboard releases in the X299 family. This coincides with Intel’s Kaby Lake X (KBL-X) & Skylake-X (SKY-X) CPU announcement from today, and marks the announcement of EVGA’s continued embattlement in the motherboard market. All the boards are X299 (LGA 2066) to support Intel’s refreshed KBL and new SKY-X CPUs, consolidating the platforms into a single socket type and with greater DIMM support. That doesn’t mean, however, that the motherboard makers will fully exploit the option of additional DIMMs for HEDT CPUs; EVGA has elected to forfeit half the DIMMs on the new EVGA X299 DARK board in favor of greater overclocking potential. We’ll talk through the specs on the new EVGA X299 DARK, X299 Micro, and X299 FTW K, along with VRM design and power components used.
The motherboard lineup does not yet include pricing or hard release dates, but we do know that the tiering will go: Dark > FTW K > Micro, with regard to price.
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