We already explained this amply in our AMD Ryzen R7 1800X review, primarily on pages 2 and 3 (but also throughout the article), but it's worth highlighting in video form for folks who prefer not to read articles. It's unfortunate that the test methodology and logistical pages were largely overlooked in the review -- most folks just jumped straight to the conclusion or gaming results, sadly -- so we are highlighting again, in video format, some of the things discussed on those pages.
As stated several times in this new video, we strongly encourage checking out the article. We are delaying our R7 1700 review by a day because of the addition of this video to our release schedule. There's not much more to say here, so we'll just embed that below:
Intel has enjoyed relatively unchallenged occupancy of the enthusiast CPU market for several years now. If you mark the FX-8350 as the last major play prior to subsequent refreshes (like the FX-8370), that marks the last major AMD CPU launch as 2012. Of course, later launches in the FX-9000 series and FX-8000 series updates have been made, but there has not been an architectural push since the Bulldozer/Piledriver/Steamroller series.
AMD Ryzen, then, has understandably generated an impregnable wall of excitement from the enthusiast community. This is AMD’s chance to recover a market it once dominated, back in the Athlon x64 days, and reestablish itself in a position that minimally targets parity in price to performance. That’s all AMD needs: Parity. Or close to it, anyway, while maintaining comparable pricing to Intel. With Intel’s stranglehold lasting as long as it has, builders are ready to support an alternative in the market. It’s nice to claim “best” on some charts, like AMD has done with Cinebench, but AMD doesn’t have to win: they have to tie. The momentum to shift is there.
Even RTG competitor nVidia will benefit from this upgrade cycle. That’s not something you hear a lot – nVidia wanting AMD to do well with a launch – but here, it makes sense. A dump of new systems into the ecosystem means everyone experiences revenue growth. People need to buy new GPUs, new cases, new coolers, and new RAM to accompany any moves to Ryzen. Misalignment of Vega and Ryzen make sense in the sense of not smothering one announcement with the other, but does mean that AMD is now rapidly moving toward Vega’s launch. Those R7 CPUs don’t necessarily fit best with an RX 480; it’s a fine card, just not something you stick with a $400-$500 CPU. Two major launches in short order, then, one of which potentially drives system refreshes.
AMD must feel the weight borne by Atlas at this moment.
In this ~11,000 word review of AMD’s Ryzen R7 1800X, we’ll look at FPS benchmarking, Premiere & Blender workloads, thermals and voltage, and logistical challenges. (Update: 1700 review here).
With the impending release of AMD Ryzen comes a wave of related product reveals. CyberPower is now offering preorders for several varieties of prebuilt PCs that take advantage of the new CPUs.
The four models below were described in CyberPower’s press release, and an additional four can be found on their website: the AMD Ryzen 7X Configurator, Mega Special III, Mega Special IV, and Winter Gaming Special II. Each of these configurations can be customized with alternate or additional parts, including “high-performance gaming memory, solid state drives, graphics cards, and gaming peripherals.” During the pre-sale, Corsair Hydro H60 AIO liquid coolers are included as a free upgrade, considering the limited launch-day support for AM4. CyberPower will in fact do a general “Pro OC” for a price, but there are plenty of free resources online for those interested.
Following months of nonstop leaks and speculation, AMD today has officially announced its Ryzen R7 lineup, base specifications, and pricing for 8C/16T products. AMD is expected to follow-up later with lower-end SKU launches – if the leaks are to be believed, that’d be R3 and R5 – leaving today’s focus entirely on the 8C/16T “R7” lineup. The three primary CPU SKUs announced are the R7 1700, R7 1700X, and R7 1800X (in order of price/performance), each of which we hope to test in short order.
To get the immediate question out of the way: The processors will be made available on March 2 (shelf availability) at the following prices:
We’ve got a lot of Ryzen news confirmations leading into the product’s inevitable launch, and will today be focusing on the stock coolers, ASUS X370 motherboards, and die shots of the Ryzen architecture.
And there’ll be more soon, of course!
We previously noted that some motherboards at CES contained text indicating support for an AMD “S3.0 Radiator,” which we could then only assume would be a stock cooler bundled with high-end Ryzen CPUs. This was plainly on display at CES, though we couldn’t get any official information on the cooler from AMD.
AMD may have inadvertently given out information today that could narrow down the release window for their upcoming Ryzen CPUs. The possible release date information was provided by a panel description for the upcoming Game Developers Conference (GDC), where AMD will host a panel detailing Zen optimization techniques for programmers. GDC 2017 takes place from February 27-March 3. This coupled with the AMD panel description from the GDC website (and our own digging while at CES) tells us that Ryzen will ship at the end of February.
In the original panel description (that has since been changed), AMD was asking session attendees to join their “Game Engineering team members for an introduction to the recently-launched AMD Ryzen CPU.” “Recently-launched” is the key phrase and indicates that the Ryzen CPU would likely already be available prior to GDC 2017, which again is February 27-March 3.
AMD’s Ryzen platform is on its march to the launch window – likely February of 2017 – and will be pushing non-stop information until its time of delivery. For today, we’re looking at the CPU and chipset architectures in greater depth, following-up on yesterday’s motherboard reveal.
First, let’s clear-up nomenclature confusion: “Zen” is still the AMD next generation CPU architecture name. “Ryzen” is the family of CPUs, comparable to Intel’s “Core” family in some loose ways. Each Ryzen CPU will exist on the Zen architecture, and each Ryzen CPU will have its own individual alphanumeric identifier (just like always).
CES 2017 allowed our team to dig deeper into the Zen architecture, its Ryzen family of CPUs, and the ensemble of AM4 motherboards in the pipes. There are currently “more than 50” SKUs of AM4 motherboards, according to the AMD team, and that’ll include the X370, B350, A320, and A/B/X300 chipsets. In this article, we’ll provide a GN-made block diagram of Ryzen’s PCIe lanes and other features, a look at ASRock and Biostar motherboards, and some brief notes on the S3.0 radiator.
Before diving in, here’s a block diagram that GamersNexus created to better represent the Ryzen / Chipset relationship:
AMD’s CES 2017 meeting room was primarily stocked with untouchable demos: Ryzen populated about half the room, Vega took a small (but critical) corner, and HDR screens took the rest. Given the challenges of demonstrating HDR in any medium other than analog (read: human eyes), we’ll skip that for now and focus on some of the Ryzen information. If Vega interests you, check out our write-up on the basics.
AMD’s suite served as a home to motherboards from MSI, Gigabyte, ASRock, and Biostar. We already spent some time with the MSI motherboards, including a look at the VRM design for each of the two configurations on display, and will today be focusing on Gigabyte’s X370, B350, and A320 motherboards. The company didn’t have any X300 mini-ITX boards at AMD’s suite, unfortunately, but did have micro-ATX displayed alongside the usual ATX form factor motherboards.
Despite the general lack of official documentation on AM4, we were able to get hands-on with some early AM4 motherboards from MSI at CES 2017. This is the first time – from AMD or from others – that we’ve received any detail on the new AM4 products, and the first time they’ve been demonstrated in public. The company debuted its X370 XPOWER Titanium overclocking motherboard (For Ryzen) alongside a mid-range B350 Tomahawk board, neither yet adorned with a price. We do have a release date target, though.
During PAX Prime 2016, we posted some official documentation on lower-end AM4 chipsets that would ship to bulk buyers, for use in HP-like systems at Costco-like places. Since then, we’ve learned that the X370 platform will crown the AM4 chipset accompaniment, with B350 falling next under that, and A320 (already known, see: PAX) at the low-end. A320 would be comparable to A68, were we to draw parallels to previous generation platforms. From what MSI tells us, an X300 chipset will also exist, but is not responsible for lane assignment and I/O tasking in the same way that X370 and B350 are; instead, X300 will likely see exclusive use on SFF platforms, and will perform no substantial functions. This was also detailed in our PAX coverage.
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