iBUYPOWER continues to show its support for the eSports community with a new tournament. The SI’s tournament series returns this fall with the CS:GO and Overwatch Invitational in September. From the 17th to the 18th, the top 8 teams in both games, as picked by iBP, will be competing for a combined $21,000 prize pool.
In additional hardware news to what we published yesterday -- a look at Intel's Kaby Lake (7600K, 7700K, etc.), the X2 Empire unique enclosure, and Logitech's G Pro mouse -- we are today visiting topics of Samsung's GDDR6, SK Hynix's HBM3 R&D, PCIe Gen4 power budget, and Zen's CCX architecture.
The biggest news here is Samsung's GDDR6, due for 2018, but it's all important stuff. PCI-e Gen4 is looking at being fully ratified EOY 2016, HBM3 is in R&D, and Zen is imminent and finalized architecturally. We'll talk about it more specifically in our reviews.
Update: Tom's misreported on PCI-e power draw. The Gen4 PCIe interface will still be 75W.
Anyway, here's the news recap:
Memory manufacturer Samsung is developing GDDR6 as a successor to Micron's brand new GDDR5X, presently only found in the GTX 1080 and Titan XP cards. GDDR6 may feel like a more meaningful successor to GDDR5, though, which has been in production use since 2008.
In its present, fully matured form, GDDR5 operates at 8Gbps maximally, including on the RX 480 and GTX 10 series GPUs. Micron demonstrated GDDR5X as capable of approaching 12-13Gbps with proper time to mature the architecture, but is presently shipping the memory in 10Gbps speeds for the nVidia devices.
Samsung indicates an operating range of approximately 14Gbps to 16Gbps on GDDR6 at 1.35V, coupled with lower voltages than even GDDR5X by using LP4X. Samsung indicates a power reduction upwards of 20% with post-LP4 memory technology.
Samsung is looking toward 2018 for production of GDDR6, giving GDDR5X some breathing room yet. As for HBM, SK Hynix is already looking toward HBM3, with HBM2 only presently available in the GP100 Accelerator cards. HBM3 will theoretically run a 4096-bit interface with upwards of 2TB/s throughput, at 512GB/s per stack. We'll talk about this tech more in the semi-distant future.
Tom's Hardware this week reported on the new PCI Express 4.0 specification, primarily detailing a push toward a minimum spec of 300W power transfer through the slot, but could be upwards of 500W. Without even talking about the bandwidth promises – moving to nearly 2GB/s for a single lane – the increase of power budget will mean that the industry could begin a shift away from PCI-e cables. The power would obviously still come form the power supply, but would be delivered through pins in the PCI-e slots rather than through an extra cable.
This same setup is what allows cards like a 750 Ti to function only off the PCI-e slot, because the existing spec allows for 75W to push through the PCIe bus. PCI-e 4.0 should be ratified by the end of 2016 by the PCI-SIG team, but we don't yet know the roll-out plans for consumer platforms.
AMD also detailed more of its Zen CPU architecture, something we talked about last week when the company camped out near IDF for an unveil event. The Summit Ridge chips have primarily been on display thus far, showing an 8C/16T demo with AMD's implementation of SMT, but we haven't heard much about other processors.
AMD is ditching modules in favor of CPU Complexes, or a CCX, each of which will host four CPU cores. Each CCX runs 512KB of L2 Cache per core, as seen in this block diagram, with L3 sliced into four pieces for 8MB total low-order address interleave cache. AMD says that each core can communicate with all cache on the CCX, and promises the same latency for all accesses.
It looks like the lowest SKU chips will still be quad-cores at a minimum.
Host: Steve "Lelldorianx" Burke
Video: Andrew "ColossalCake" Coleman
This week following IDF has posted several news items for general computing technology and for product announcements. As one might expect, Intel unveiled more Kaby Lake information at its self-titled "Intel Developer Forum," and OCaholic posted a SKU listing for the new Kaby Lake CPUs up to the 7700K. Our news round-up video discusses the limited specifications of the i5-7600K, i7-7700K, lower TDP chips, and Intel's plans for launch.
We also look to the world of peripherals for the Logitech G Pro mouse, equipped with the PMW3366 sensor, and to the world of cases for X2's new "Empire" enclosure.
More in the video or script below, if you prefer:
Despite AMD’s FreeSync arriving later than nVidia’s G-Sync, FreeSync has seen fairly widespread adoption, especially among gaming monitors. The latest monitor – and the 101st – to officially support FreeSync is Lenovo’s Y27f. This also marks the announcement of Lenovo’s first FreeSync monitor.
We've got a new thermal paste applicator tool that'll help ensure consistent, equal spread of TIM across cooler surfaces for future tests. As we continue to iterate on "Hybrid" DIY builds, or even just re-use coolers for testing, we're also working to control for all reasonable variables in the test process. Our active ambient monitoring with thermocouple readers was the first step of that, and ensures that even minute (resolution 0.1C) fluctuations in ambient are accounted for in the results. Today, we're adding a new tool to the arsenal. This is a production tool used in Asetek's factory, and is deployed to apply that perfect circle of TIM that comes pre-applied to all the liquid cooler coldplates. By using the same application method on our end (rather than a tube of compound), we eliminate the chance of users changing application methods and eliminate the chance of applying too much or too little compound. These tools ensure exactly the same TIM spread each time, and mean that we can further eliminate variables in testing. That's especially important for regression testing.
This isn't something you use for home use, it is for production and test use. When cooling manufacturers often fight over half a degree of temperature advantage, it would be unfair to the products to not account for TIM application, which could easily create a 0.5C temperature swing. For consumers, that's irrelevant -- but we're showing a stack of products in direct head-to-head comparisons, and that needs to be an accurate stack.
No reference card has impressed us this generation, insofar as usage by the enthusiast market. Primary complaints have consisted of thermal limitations or excessive heat generation, despite reasonable use cases with SIs and mITX form factor deployments. For our core audience, though, it's made more sense to recommend AIB partner models for superior cooling, pre-overclocks, and (normally) lower prices.
But that's not always the case – sometimes, as with today's review unit, the price climbs. This new child of Corsair and MSI carries on the Hydro GFX and Seahawk branding, respectively, and is posted at ~$750. The card is the construct of a partnership between the two companies, with MSI providing access to the GP104-400 chip and a reference board (FE PCB), and Corsair providing an H55 CLC and SP120L radiator fan. The companies sell their cards separately, but are selling the same product; MSI calls this the “Seahawk GTX 1080 ($750),” and Corsair sells only on its webstore as the “Hydro GFX GTX 1080.” The combination is one we first looked at with the Seahawk 980 Ti vs. the EVGA 980 Ti Hybrid, and we'll be making the EVGA FTW Hybrid vs. Hydro GFX 1080 comparison in the next few days.
For now, we're reviewing the Corsair Hydro GFX GTX 1080 liquid-cooled GPU for thermal performance, endurance throttles, noise, power, FPS, and overclocking potential. We will primarily refer to the card as the Hydro GFX, as Corsair is the company responsible for providing the loaner review sample. Know that it is the same as the Seahawk.
This week's Ask GN episode answers viewer questions about FinFET vs. Planar, the impact of cooling on power consumption, CPU load for 120Hz / 144Hz displays, liquid cooler testing, and a few extras. We spend most the time talking liquid coolers and cooler testing – a fitting topic, having done multiple “Hybrid” video card builds lately.
The full list of questions with their timestamps can be found below the video. Thanks to our viewers for the questions and, as always, post more in the video comments on YouTube for inclusion in next week's episode.
German manufacturer Be Quiet! has released its latest line of ultra-quiet fans – the SilentWings 3, first found in the Dark Base 900 that we saw at Computex. Be Quiet! is a company whose name backs most product roll-outs, as representative Christoph Katzer explained to us. The company focuses heavily on build quality and silence, and the new SilentWings 3 fans have been redesigned with fluid-dynamic bearings, now using brass cores and seven blades that have a funnel-shaped design. The frame is rubberized to enable a reported near-inaudible sound level – according to Be Quiet!, the 120mm model produces 16.4 decibels and the 140mm model 15.5 decibels. To put that into perspective, someone whispering is about 30 decibels. The rubberized design also reduces vibration levels to further mitigate noise.
We looked at Be Quiet!'s Dark Base 900 PC case at Computex and were impressed. The SilentWings 3 fans debuted in the DB900, about 3 months prior to launch individually, so owners of the DB900 are already equipped with the new fans.
MSI has announced it will be releasing five new GTX 1060 3GB cards. The new Pascal video cards are set for an August release, and they will take on AMD’s 4GB RX 480 in the $200 - $250 market. The MSRP for the GTX 1060 3GB cards will be $200, but some cards may be priced higher to account for pre-overclocks and AIB partner value adds, like improved cooling.
The GTX 1060 3GB cards have 1152 CUDA cores, operating at a base clock of 1506MHz and a boost clock of 1708MHz – the same as the 6GB model, but with 128 fewer cores. MSI, like other AIB partners, will offer factory overclocked cards coupled with brand heatsinks.
For our average multiple interviews per year with Chris Roberts and team, this year has been a quiet one. The team's been keeping their heads down while working on finalizing Squadron 42, the single-player release of Star Citizen, for a major release this year. Version 2.5 and 2.6 of the Star Citizen client will soon be released – a matter of days for 2.5, in theory – but that hasn't stopped CIG CEO Chris Roberts from detailing plans for 3.0 while at Gamescom 2016.
The Gamescom event primarily covered procedural planet technology. This is a topic we discussed with Roberts back in 2014, who stated the following when asked for CIG's definition of procedural generation: