Most of last week's hardware news revolved around AMD and its Navi and Ryzen product disclosures from the tech day, but plenty still happened during E3 week: Microsoft, for instance, announced its Scarlett console and rediscovered virtual memory, Comcast was caught violating the Consumer Protection Act over 445,000 times, USB 4.0 got lightly detailed for a 2020 launch, and more.

Show notes after the video embed.

AMD’s X570 chipset marks the arrival of some technology that was first deployed on Epyc, although that was done through the CPU as there isn’t a traditional chipset. With the shift to PCIe 4, X570 motherboards have grown more complex than X370 and X470, furthered by difficulties cooling the higher power consumption of X570. All of these changes mean that it’s time to compare the differences between X370, X470, and X570 motherboard chipsets, hopefully helping newcomers to Ryzen understand the changes.

The persistence of AMD’s AM4 socket, still slated for life through 2020, means that new CPUs are compatible with older chipsets (provided the motherboard makers update BIOS for detection). It also means that older CPUs (like the reduced price R5 2600X) are compatible with new motherboards, if you for some reason ended up with that combination. The only real downside, aside from potential cost of the latter option, is that new CPUs on old motherboards will mean no PCIe Gen4 support. AMD is disabling it in AGESA at launch, and unless a motherboard manufacturers finds the binary switch to flip in AGESA, it’ll be off for good. Realistically, this isn’t all that relevant: Most users will never touch the bandwidth of Gen4 for this round of products (in the future, maybe), and so the loss of running a new CPU on an old motherboard may be outweighed by the cost savings of keeping an already known-good board, provided the VRM is sufficient.

AMD’s technical press event bore information for both AMD Ryzen and AMD Navi, including overclocking information for Ryzen, Navi base, boost, and average clocks, architectural information and block diagrams, product-level specifications, and extreme overclocking information for Ryzen with liquid nitrogen. We understand both lines better now than before and can brief you on what AMD is working on. We’ll start with Navi specs, die size, and top-level architectural information, then move on to Ryzen. AMD also talked about ray tracing during its tech day, throwing some casual shade at NVIDIA in so doing, and we’ll also cover that here.

First, note that AMD did not give pricing to the press ahead of its livestream at E3, so this content will be live right around when the prices are announced. We’ll try to update with pricing information as soon as we see it, although we anticipate our video’s comments section will have the information immediately. UPDATE: Prices are $450 for the RX 5700 XT, $380 for the RX 5700.

AMD’s press event yielded a ton of interesting, useful information, especially on the architecture side. There was some marketing screwery in there, but a surprisingly low amount for this type of event. The biggest example was taking a thermographic image of two heatsinks to try and show comparative CPU temperature, even though the range was 23 to 27 degrees, which makes the delta look astronomically large despite being in common measurement error. Also, the heatsink actually should be hot because that means it’s working, and taking a thermographic image of a shiny metal object means you’re more showing reflected room temperature or encountering issues with emissivity, and ultimately they should just be showing junction temperature, anyway. This was our only major gripe with the event -- otherwise, the information was technical, detailed, and generally free of marketing BS. Not completely free of it, but mostly. The biggest issue with the comparison was the 28-degree result that exited the already silly 23-27 degree range, making it look like 28 degrees was somehow massively overheating.

amd ryzen temperature invalid

Let’s start with the GPU side.

As we board another plane, just five days since landing home from Taipei, we're recapping news leading into next week's E3 event, positioned exhaustingly close to Computex. This recap talks AMD and Samsung partnerships on GPUs, Apple's $1000 monitor stand and accompanying cheese grater, and the Radeon Vega II dual-GPUs located therein. We also talk tariff impact on pricing in PC hardware and, as an exclusive story for the video version, we talk about the fake "X499" motherboard at Computex 2019.

Show notes below the video embed.

As we’ve been inundated with Computex 2019 coverage, this HW News episode will focus on some of the smaller news items that have slipped through the cracks, so to speak. It’s mostly a helping of smaller hardware announcements from big vendors like Corsair, NZXT, and SteelSeries, with a side of the usual industry news.

Be sure to stay tuned to our YouTube channel for Computex 2019 news.

Our viewers have long requested that we add standardized case fan placement testing in our PC case reviews. We’ve previously talked about why this is difficult – largely logistically, as it’s neither free in cost nor free in time – but we are finally in a good position to add the testing. The tests, we think, clearly must offer some value, because it is one of our most-requested test items over the past two years. We ultimately want to act on community interests and explore what the audience is curious about, and so we’ve added tests for standardized case fan benchmarking and for noise normalized thermal testing.

Normalizing for noise and running thermal tests has been our main, go-to benchmark for PC cooler testing for about 2-3 years now, and we’ve grown to really appreciate the approach to benchmarking. Coolers are simpler than cases, as there’s not really much in the way of “fan placement,” and normalizing for a 40dBA level has allowed us to determine which coolers have the most efficient means of cooling when under identical noise conditions. As we’ve shown in our cooler reviews, this bypasses the issue where a cooler with significantly higher RPM always chart-tops. It’s not exactly fair if a cooler at 60dBA “wins” the thermal charts versus a bunch of coolers at, say, 35-40dBA, and so normalizing the noise level allows us to see if any proper differences emerge when the user is subjected to the same “volume” from their PC cooling products. We have also long used these for GPU cooler reviews. It’s time to introduce it to case reviews, we think, and we’ll be doing that by sticking with the stock case fan configuration and reducing case fan RPMs equally to meet the target noise level (CPU and GPU cooler fans remain unchanged, as these most heavily dictate CPU and GPU coolers; they are fixed speeds constantly).

Computex 2019 is next week -- a few days from now, technically -- and hardware news has been alight with PCIe 5.0 and DDR5 discussion for Intel platforms, Huawei's ban from the US, DDR4 overclocking close to 6GHz, and more. Intel's biggest news is certainly the PCIe 5 and DDR 5 discussion, which will be our leading story for today's news.

Written show notes are below the video embed.

The Versa J24 TG RGB Edition is a budget case from Thermaltake. Our understanding is that the J22/J23/J24/J25 are basically the same chassis with the same number of fans and different front panels, but trying to remember Thermaltake case SKUs is a great way to go crazy. The sample sent to us for review is specifically the RGB edition and not the newer ARGB edition, which may or may not have been a mistake on Thermaltake’s part, but saving $10 over an extra vowel is a win in our book.

The case interior is just big enough to fit an ATX motherboard with little room to spare on any side, but there are adequate cutouts along the front edge to route all the cables. The case is about as small as it can be without entering Q500L territory, almost exactly the same dimensions as the Meshify C but slightly longer. Cable management room is understandably restricted. There is space under the PSU shroud, but users with one or more 3.5” drives will struggle to find a place for power cables. The HDD cage can be removed or shifted 2.5cm back towards the rear of the case, a welcome change from budget cases that usually rivet the HDD cage in place.

Computex is coming up. We'll be at the show next week, which means most of our time will likely be spent covering new X570 motherboards for AMD and AMD's announcements, with NVIDIA's presence sparse at the show and Intel's focused on mobile. Beyond the motherboards and CPUs, we already have numerous cooler and case manufacturers lined-up for meetings, alongside some GPU board partners. In the meantime, this past week has set the stage for Computex with a focus on security vulnerabilities, tariffs, and X570 chipset sightings.

The show notes are below the embedded video.

We recently revamped our CPU benchmarking for significantly expanded workstation benchmarks, allowing us to better analyze CPU performance in non-gaming scenarios. Of course, this methodology update wouldn’t be complete without revisions to our gaming tests. These updates include more games, better testing in games where we’ve encountered GPU bottlenecks (that limit usefulness in CPU reviews), and improved accuracy of results. This takes the knowledgebase of what we’ve learned over the past year and builds upon shortcomings we’ve found.

With Ryzen 3000 CPUs just around the corner, likely announced at Computex next week, we have begun the process of preparing our test bench for the inevitable 3700X (or whatever they end up calling it). This means re-running CPUs through our testing until we repopulate the charts in time for Ryzen 3’s release, which is a process that we’ll begin publishing today.

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