Hardware news this week has been hopping. First off, for GN, we’ve published a lot of content on YouTube in the past week: We revisited Google Stadia for latency, revisited the FX-8370 CPU, and talked about the AMD Phenom II 1090T in 2020. We’re trying to figure out how to unbury ourselves from a constant production cadence to get some time for publishing the article versions of these again, which mostly involves some optimization on the staffing side.
For this week, news includes a quick notice on an upcoming stream competition of GN Steve vs. JayzTwoCents, hosted by LinusTechTips. In actual hardware news, the RTX 3000 series (“3080,” for now) has some early plans for an announcement date, the RTX 2070 Super isn’t dead yet, AMD & NVIDIA marketshare gets discussed, Arm’s co-founder doesn’t seem to be in favor of an NVIDIA acquisition, and more.
Last week, Intel dropped the bombshell that its 7nm process would be delayed. As such, much of the news discussion this week centers on that news and its various repercussions. As is evident below, the first half of our news this week will be dedicated to the Intel news show. As it relates to Intel’s 7nm delay, Intel may be dealing with a potential lawsuit, has already reshuffled its leadership and internal organization, and is reportedly preparing to do more business with TSMC.
We also have news regarding NZXT revising its BLD warranty (finally) regarding users enabling XMP with their memory, which was ridiculous to begin with. There’s also AMD’s Q220 earnings report, and more.
Within GN, we recently took a look at a cringy waifu computer case from AliExpress, and we also compared a $1 thermal pad to a $10 thermal pad. Overall, GN has been experiencing a bit of down time as we’ve been revising some of our methodology and implementing new test tools. We posted a major piece exposing MSI’s shady and (what we believe to be) unethical review practices, too, and that’s worth watching. The improvements from these efforts should show up within the next couple weeks, so stay tuned.
News article and video embed are below.
This week’s news is anchored by yet more manufacturing woes from Intel, this time at 7nm. Intel has had to delay its 7nm products due to less than great yields, although the exact problem causing poor yields wasn’t disclosed. Joining Intel in manufacturing trouble is Samsung, as the company is reportedly struggling to improve its 5nm yields.
We also have leaks that NVIDIA is internally working on Ampere launch timelines now, which would point toward early rumors that the cards would see an August/September launch window. Igor of Igor’s Lab may be on the mark with that one. Finally, we have some smaller AMD and Cooler Master news to go over, as well as ARM interest by Nvidia.
News article and video embed are below, as usual.
The Phanteks Enthoo Pro 2 is a case that we last saw at CES 2020, back in January. It’s a giant liquid cooling-focused enclosure built on the existing P600S chassis and, as such, it differs from our usual case reviews in much the same way that the O11 Dynamic XL review did. Incidentally, the Phanteks reviewer’s guide suggests that this case is intended to directly compete with the XL, as well as Fractal’s Define 7 XL, be quiet!’s Dark Base Pro 900, and Corsair’s Obsidian Series 1000D. Today, we’ll be discussing the airflow and some unusual features of the Enthoo Pro 2, including our first hands-on testing of Phanteks’ self-dubbed “High Performance Fabric.”
While the week started off rather slowly, hardware news picked up towards the end of the week. As such, we have plenty to cover, including a GN exclusive, in which we’re able to confirm the rumored 12-pin PSU connectors for Nvidia’s Ampere. The father of Linux, Linus Torvalds, is also back in the news, this time with a rant over AVX-512. We also go over the finalized DDR5 spec, which will set the stage for industry adoption in 2021.
Elsewhere, we have a bit more news on Apple Silicon as it relates to manufacturing, a fresh Alder Lake rumor, Skylake-X Refresh reaching EOL, and a bit more. As always, the news article and video embed follow below.
Today is a round-up of the best airflow-focused cases currently out, which can also be tuned to be good acoustic performers by nature of unrestricted intakes. Over all the years that we’ve been doing case reviews, we’ve advocated for high airflow designs. That generally implies lots of mesh and lots of fans, like the classic Cooler Master HAF cases that adopted “high airflow” as a brand name. As those cases aged and optical drives fell out of favor, front panel designs became increasingly clean and minimalistic, and therefore increasingly closed-off. Now the tide has turned again, and in 2020, we have more airflow cases than we know what to do with. Today, we’ll be covering some of our top choices--this isn’t our yearly best-and-worst cases roundup, it’s just a selection of airflow-focused cases with good value. We have almost 300 rows of test data multiplied across about 7 sheets, so although we’ll be limiting ourselves to cases we’ve reviewed, that’s still a big list. As always, let us know if there’s another case we should check out in the comments below.
Another big week in hardware and technology news. It looks like the perpetually delayed Atari VCS is finally set to ship later this fall, hopefully. We also have news of Huawei’s Kunpeng 920 CPU, talk about Volta and Turing encoders shipping with the GTX 1650, news of Apple also ditching AMD, and more.
At GN, we recently went over the basics of overclocking the Ryzen 5 3600 XT, Infinity Fabric, and memory. We also have extensive review coverage of AMD’s new XT series of CPUs: The Ryzen 3900X, the Ryzen 7 3800XT, and the Ryzen 5 3600XT. We further introduced our new GN PC Component shirt, and you can get one here. The GN store continues to be the best way to support our work.
News follows below, with the article and video embed.
The Lian Li Lancool II Mesh is a revision of the original Lancool II, which we reviewed in December of last year. For the most part, the Mesh is a simple panel swap, so the build notes from that earlier coverage still apply. We first saw the prototype Mesh edition during our tour of Lian Li’s Taiwanese factories earlier this year, and the updates we discussed back then have made their way to the final product. We’ll mostly limit this build section to differences from the original case.
As a reminder, the Lancool II is a chassis that already exists and was already reviewed, but this mesh version makes significant changes to the exterior paneling. For these reasons, we won’t fully recap our build quality thoughts from the original review, but we will go back over what has been addressed by Lian Li. This means that, for the complete picture, you should also check our original Lancool II review.
The Phanteks P400A Digital was our winner for best overall case in 2019, but our feelings were mixed about the less-expensive P300A because of its single stock fan. Today, we’re reviewing the latest addition to the family, the Phanteks Eclipse P500A Digital, to see whether Phanteks is back on track.
Like the P400A, the P500A comes in both normal and “digital” variants. The base model comes with two 140mm non-RGB fans, the digital version comes with case lighting effects and three 140mm “D-RGB” fans, which is how Phanteks refers to addressable RGB. Listed specs for the fans are identical other than the LEDs. The lighting is compatible with the 3-pin 5V headers used by ASUS, MSI, ASRock, etc. Other than the fans, thin strips at the top of the front panel and along the edge of the PSU shroud are lit. The base model has a reset button, the D-RGB model replaces this with color and mode buttons. The built-in controller has baked-in lighting profiles for those that can’t or don’t want to use control software.
This week’s news recap talks Microsoft’s hardware-accelerated GPU scheduling (something we’ve since benchmarked, written and run after this news piece), alongside discussion of technical documents for Alder Lake and the new LGA1700 socket. We’ll also be talking about a “new” GTX 1650 Ultra, some interesting marketing from T-Force, and the return of data caps.
At GN, we continue to expand our thermal analysis with thermal pads, as we looked at the Thermal Grizzly Carbonaut Pad Vs. IC Diamond Thermal Pad and compared them to pastes. We also looked at how AMD’s silicon has matured, comparing Old vs Original AMD Ryzen 5 3600 CPUs.
News video embed and article below, as usual.
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